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MMSZ5221B Datasheet

500mW SURFACE MOUNT ZENER DIODE

Features  500mW Power Dissipation  General Purpose, Medium Current  Ideally Suited for Automated Assembly Processes  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. “Green” Device (Notes 3 & 4)  Qualified to AEC-Q101 Standards for High Reliability MMSZ5221B - MMSZ5259B 500mW SURFACE MOUNT ZENER DIODE Mechan.


Diodes
MMSZ5221B.pdf

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Diodes MMSZ5221B Datasheet

Features  500mW Power Dissipation  General Purpose, Medium Current  Ideally Suited for Automated Assembly Processes  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. “Green” Device (Notes 3 & 4)  Qualified to AEC-Q101 Standards for High Reliability MMSZ5221B - MMSZ5259B 500mW SURFACE MOUNT ZENER DIODE Mechanical Data  Case: SOD123  Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0  Moisture Sensitivity: Level 1 per J-STD-020  Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208  Polarity: Cathode Band  Weight: 0.01 grams (Approximate) SOD123 Top View Ordering Information (Note 5) Part Number (Type Number)-7-F* (Type Number)Q-7-F* (Type Number)-13-F* (Type Number)Q-13-F* Qualification Commercial Automotive Commercial Automotive Case SOD123 SOD123 SOD123 SOD123 Packaging 3,000/Tape & Reel 3,000/Tape & Reel 10,000/Tape.






JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD SOD-123 Plastic-Encapsulate Diodes MMSZ5221B-MMSZ5259B ZENER DIODE FEATURES • Planar Die Construction • Ultra-Small Surface Mount Package • General purpose, Medium Current • Ideally Suited for Automated Assembly Processes SOD-123 Maximum Ratings(Ta=25℃ unless otherwise specified) Characteristic.


JCET
MMSZ5221B.pdf

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JCET MMSZ5221B Datasheet

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD SOD-123 Plastic-Encapsulate Diodes MMSZ5221B-MMSZ5259B ZENER DIODE FEATURES • Planar Die Construction • Ultra-Small Surface Mount Package • General purpose, Medium Current • Ideally Suited for Automated Assembly Processes SOD-123 Maximum Ratings(Ta=25℃ unless otherwise specified) Characteristic Symbol Forward Voltage (Note 2) @ IF = 10mA VF Power Dissipation(Note 1) Pd Thermal Resistance, Junction to Ambient Air RθJA Junction Temperature Tj Storage Temperature Range Tstg Value 0.9 350 357 150 -55~+150 Unit V mW ℃/W Я Я Notes:1. Device mounted on ceramic PCB; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm2. 2. Tested with pulses, Tp≤1.0ms. www.cj-elec.com 1 C,Mar,2015 ELECTRICAL CHARACTERISTICS Ta=25℃ unless otherwise specified Type Number MMSZ5221B MMSZ5223B MMSZ5225B MMSZ5226B MMSZ5227B MMSZ5228B MMSZ5229B MMSZ5230B MMSZ5231B MMSZ5232B MMSZ5233B MMSZ5234B MMSZ5235B MMSZ5236B MMSZ5237B MMSZ5238B MMSZ5239B MMSZ52.






HITANO ENTERPRISE CORP. MMSZ5221B THRU MMSZ5259B TECHNICAL SPECIFICATIONS OF SURFACE MOUNT SILICON ZENER DIODES FEATURES * Planar Die construction * Zener Voltages from 2.4V - 39V * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals:Solder plated, solderable per M.


HITANO
MMSZ5221B.pdf

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HITANO MMSZ5221B Datasheet

HITANO ENTERPRISE CORP. MMSZ5221B THRU MMSZ5259B TECHNICAL SPECIFICATIONS OF SURFACE MOUNT SILICON ZENER DIODES FEATURES * Planar Die construction * Zener Voltages from 2.4V - 39V * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes SOD-123 MECHANICAL DATA * Case: Molded Plastic * Terminals:Solder plated, solderable per MIL-STD-202, Method 208 * Polarity: See Diagram Below * Mounting position: Any * Weight: 0.008 gram Approx. MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 oC ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%. .028(0.7) .019(0.5) .154(3.9) .141(3.6) .110(2.8) .098(2.5) .071(1.8) .055(1.4) .008 (0.2) MAX. .005 (0.12) MAX. .053(1.4) .037(1.0) .016 (0.4) MIN. Dimensions in inches(millimeters) Zener Current see Table "Characteristics" Power Dissipation (Notes 1) at Tamb=25oC Peak Forward Surge Current, 8.3ms single half si.








 

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