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MMZ0603S800C Datasheet

Part Number MMZ0603S800C
Manufacturers TDK
Logo TDK
Description Chip Beads
Datasheet MMZ0603S800C DatasheetMMZ0603S800C Datasheet (PDF)

(1/3) Chip Beads(SMD) For Signal Line MMZ Series MMZ0603 Type FEATURES • This is a multilayered chip bead product with dimensions of L0.6× W0.3× T0.3mm. • The product is magnetically shielded, allowing high density mounting. • We refined the rules for internal conductor design to reduce floating capacity between conductors, which in turn has contributed to a dramatic improvement in high frequency characteristics. We have also been able to expand and reinforce the EMI suppression in the GHz rang.

  MMZ0603S800C   MMZ0603S800C






Chip Beads

(1/3) Chip Beads(SMD) For Signal Line MMZ Series MMZ0603 Type FEATURES • This is a multilayered chip bead product with dimensions of L0.6× W0.3× T0.3mm. • The product is magnetically shielded, allowing high density mounting. • We refined the rules for internal conductor design to reduce floating capacity between conductors, which in turn has contributed to a dramatic improvement in high frequency characteristics. We have also been able to expand and reinforce the EMI suppression in the GHz range. • It is a product conforming to RoHS directive. APPLICATIONS The removal of EMI components from signal lines in various modules, cellular phones and other sets that use very small components. PRODUCT IDENTIFICATION MMZ 0603 S 121 C T (1) (2) (3) (4) (5) (6) (1) Series name (2) Dimensions L× W (3) Material code (4) Nominal impedance 121:120Ω at 100MHz (5) Characteristic type (6) Packaging style T:Taping HANDLING AND PRECAUTIONS • Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. • After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. • Do not expose the inductors to stray magnetic fields. • Avoid static electricity discharge during handling. • When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350°.


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