Schottky Diodes. MS8250-48 Datasheet

MS8250-48 Datasheet PDF


Part Number

MS8250-48

Description

Schottky Diodes

Manufacture

Microsemi

Total Page 2 Pages
Datasheet
Download MS8250-48 Datasheet


MS8250-48
SCHOTTKY DIODES
TM ® Silicon Low Barrier
MS8250 – 48
Features
For Detector and Mixer Applications
Vertical Offset Contact
Low Capacitance Package (0.09 pF)
Available as Bondable Chips
Priced for Commercial Applications
Specifications @ 25°C
VF (1 mA): 0.39 V Max.
VB (10 A): 3 V Min.
IR (1 V): 100 nA Max.
RS (1 mA): 8 Typ.
CT (0 V, 1 MHz): 0.24 pF Max., 0.20 pF Typ.
Maximum Ratings
Incident Power
Reverse Voltage
Forward Current
Power Dissipation
Operating Temperature
Storage Temperature
+20 dBm @ 25°C
3V
10 mA @ 25°C
50 mW @ 25°C
-65°C to +150°C
-65°C to +150°C
Description
The MS8520-48 is low barrier, N-type, silicon Schottky
diode designed for applications in microwave mixers and
detectors at frequencies from below 100 MHz to
beyond 40 GHz.
These Schottky diodes are packaged in the newly
developed ultra-low capacitance M48 package that has
shown improved sensitivity in Doppler Transceiver
mixer/detector mounts at 24 GHz.
Microsemi’s vertical offset chip bond pad design
allows rotational symmetry in a waveguide mount and
rugged bonding to the top contact without damage to the
junction. MSC’s semiconductor process also results in
a low 1/F noise device with low specified RS and CJ
values.
Copyright 2008
Rev: 2009-01-19
Microsemi
Microwave Products
75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748
Page 1

MS8250-48
TM ®
M48
E
F
G
A Dia.
D
C
B Dia.
DIM
A
B
C
D
E
F
G
CP = 0.09 pF.
LP = 0.50 nH.
INCHES
MIN.
MAX.
0.059
0.064
0.076
0.084
0.190
0.210
0.007
0.015
0.059
0.065
0.069
0.087
0.059
0.065
MM
MIN.
MAX.
1.499
1.626
1.930
2.134
4.826
5.334
0.178
0.381
1.499
1.651
1.753
2.210
1.499
1.651
SCHOTTKY DIODES
Silicon Low Barrier
MS8250 – 48
Spice Model Parameters
IS RS N CJ0 CP M EG VJ BV IBV
A
pF pF
eV V V A
1E-8 8 1.07 0.11 0.09 0.50 0.69 0.5 3 1E-5
Ordering Information
The MS8520-48 diode is also available as a bondable
chip, MS8520-P10, and in a variety of package types.
Contact factory for availability.
IMPORTANT: For the most current data, consult our website: www.MICROSEMI.com
Specifications are subject to change. Consult factory for the latest information.
These devices are ESD sensitive and must be handled using ESD precautions.
- The MS8250 Series of products are
.supplied with a RoHS complaint Gold
finish
- Other package styles are available on
request.
Copyright 2008
Rev: 2009-01-19
Microsemi
Microwave Products
75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748
Page 2





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