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MSESD5.0C

msksemi

Diode

MSESD5.0C Features  Small Body Outline Dimensions: 0.039″x 0.024″(1.0 mm x 0.60 mm)  Protects one I/O or power line ...


msksemi

MSESD5.0C

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Description
MSESD5.0C Features  Small Body Outline Dimensions: 0.039″x 0.024″(1.0 mm x 0.60 mm)  Protects one I/O or power line  Low Clamping Voltage  Ultra Low Capacitance:0.5pF  Working Voltage: 5 V  Low Leakage Current  Response Time is Typically < 1 ns IEC COMPATIBILITY (EN61000-4)  IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)  IEC 61000-4-4 (EFT) 40A (5/50ns) DFN-2L Mechanical Characteristics  DFN-2L package  Molding compound flammability rating: UL 94V-0  Marking: Marking Code  Packaging: Tape and Reel per EIA 481  RoHS/WEEE Compliant Schematic & PIN Configuration Applications  Laptop Computers  Cellular Phones  Digital Cameras  Personal Digital Assistants (PDAs) DFN-2L (Top View) ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Parameter IPP VC VRWM IR VBR IT IF VF Ppk C Maximum Reverse Peak Pulse Current Clamping Voltage @ IPP Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Bre...




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