(MT58Lxxxx) 8Mb SYNCBURST SRAM
™ t e 8Mb SYNCBURST e h SRAMS
4U
.
m o c
8Mb: 512K x 18, 256K x 32/36 3.3V I/O, PIPELINED, DCD SYNCBURST SRAM
MT58L...
Description
™ t e 8Mb SYNCBURST e h SRAMS
4U
.
m o c
8Mb: 512K x 18, 256K x 32/36 3.3V I/O, PIPELINED, DCD SYNCBURST SRAM
MT58L512L18D, MT58L256L32D, MT58L256L36D
3.3V VDD, 3.3V I/O, Pipelined, DoubleCycle Deselect
a D . FEATURES w w w
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Fast clock and OE# access times Single +3.3V +0.3V/-0.165V power supply (VDD) Separate +3.3V isolated output buffer supply (VDDQ) SNOOZE MODE for reduced-power standby Common data inputs and data outputs Individual BYTE WRITE control and GLOBAL WRITE Three chip enables for simple depth expansion and address pipelining Clock-controlled and registered addresses, data I/Os and control signals Internally self-timed WRITE cycle Burst control (interleaved or linear burst) Automatic power-down for portable applications 100-pin TQFP package 165-pin FBGA package Low capacitive bus loading x18, x32, and x36 versions available
100-Pin TQFP**
OPTIONS
Timing (Access/Cycle/MHz) 3.5ns/6ns/166 MHz 4.0ns/7.5ns/133 MHz 5ns/10ns/100 MHz Configurations 512K x 18 256K x 32 256K x 36
MARKING
Packages 100-pin TQFP (2-chip enable) 100-pin TQFP (3-chip enable) 165-pin, 13mm x 15mm FBGA
Operating Temperature Range Commercial (0°C to +70°C) Industrial (-40°C to +85°C)**
Part Number Example
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MT58L512L18D MT58L256L32D MT58L256L36D
NOTE: 1. JEDEC-standard MS-026 BHA (LQFP).
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165-Pin FBGA
GENERAL DESCRIPTION
The Micron® SyncBurst™ SRAM family employs highspeed...
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