MT9N011: 9Mp CMOS Digital Image Sensor Die Features
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1/2.3-Inch, 9Mp CMOS Active-Pixel Digital Image...
MT9N011: 9Mp
CMOS Digital Image Sensor Die Features
www.DataSheet4U.com
1/2.3-Inch, 9Mp
CMOS Active-Pixel Digital Image Sensor Die
MT9N011 Die Data Sheet
For the product data sheet, refer to Aptina’s Web site: www.aptina.com
Features
Die Database
Die outline, see Figure 5 on page 14Figure 5 on page 14 Singulated die size: 8672µm ±25µm x 8369µm ±25µm Bond Pad Identification Tables, see pages 8–13
DigitalClarity®
CMOS imaging technology Low dark current Simple two-wire serial interface Auto black-level calibration Support for external mechanical shutter Support for external LED or xenon flash High frame rate preview mode with arbitrary downsize scaling from maximum resolution Programmable controls: gain, horizontal and vertical blanking, auto black level offset correction, frame size/rate, exposure, left-right and top-bottom image reversal, window size, and panning Data interfaces: parallel or serial – CCP2-compliant, sub-low-
voltage, differential signaling (sub-LVDS) – One- or two-lane mobile industry processor interface (MIPI) On-die phase-lock loop (PLL) oscillator Bayer pattern down-size scaler One-time programmable (OTP) memory for storing module information Superior low-light performance Integrated position-based color and lens shading correction
Options
Form – Die Testing – Standard (level 1) probe
Designator
D C1
Key Performance Parameters
Optical format: 1/2.3-inch (4:3) Active imager size: 6.104mm(H) x 4.578mm(V), 7.6...