CYStech Electronics Corp.
20V N-CHANNEL Enhancement Mode MOSFET
MTN2302V3
Spec. No. : C323V3 Issued Date : 2009.01.19 R...
CYStech Electronics Corp.
20V N-CHANNEL Enhancement Mode
MOSFET
MTN2302V3
Spec. No. : C323V3 Issued Date : 2009.01.19 Revised Date : 2010.06.18 Page No. : 1/9
Features
VDS=20V RDS(ON)=85mΩ(max.)@VGS=4.5V, IDS=3.6A RDS(ON)=115mΩ(max.)@VGS=2.5V, IDS=3.1A
Simple drive requirement Small package outline Capable of 2.5V gate drive Pb-free package
Symbol
MTN2302V3
Outline
TSOT-23 D
G:Gate S:Source D:Drain
GS
Absolute Maximum Ratings (Ta=25°C)
Parameter
Drain-Source
Voltage Gate-Source
Voltage Continuous Drain Current @VGS=4.5V, TA=25°C (Note 3) Continuous Drain Current @VGS=4.5V, TA=70°C (Note 3) Pulsed Drain Current (Notes 1, 2)
Maximum Power Dissipation@ TA=25℃ Linear Derating Factor
Operating Junction and Storage Temperature
Symbol VDS VGS
ID IDM PD
Tj, Tstg
Limits 20 ±8 3.2 2.6 10
1.38
0.01 -55~+150
Note : 1. Pulse width limited by maximum junction temperature. 2. Pulse width≤ 300μs, duty cycle≤2%.
3. Surface mounted on 1 in² copper pad of FR-4 board; 270°C/W when mounted on minimum copper pad
Unit V V A A A
W
W/°C °C
MTN2302V3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C323V3 Issued Date : 2009.01.19 Revised Date : 2010.06.18 Page No. : 2/9
Thermal Performance
Parameter Thermal Resistance, Junction-to-Ambient(PCB mounted)
Symbol Rth,ja
Limit 90
Note : Surface mounted on 1 in² copper pad of FR-4 board; 270°C/W when mounted on minimum copper pad
Unit °C/W
Electrical Characteristics (Tj=25°C, unless otherwise noted)
Symbol
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