CYStech Electronics Corp.
Spec. No. : C737M3 Issued Date : 2012.07.26 Revised Date : 2013.08.12 Page No. : 1/8
30V N-C...
CYStech Electronics Corp.
Spec. No. : C737M3 Issued Date : 2012.07.26 Revised Date : 2013.08.12 Page No. : 1/8
30V N-CHANNEL Enhancement Mode
MOSFET
MTN2304M3
BVDSS
ID
Features
Single Drive Requirement Low On-resistance Fast Switching Characteristic Pb-free lead plating and halogen-free package
RDSON(TYP)
VGS=10V, ID=5A VGS=4.5V, ID=4A
30V 6A 20mΩ 28mΩ
Symbol
MTN2304M3
Outline
SOT-89
G:Gate S:Source D:Drain
DG D S
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Limits
Drain-Source
Voltage Gate-Source
Voltage
Continuous Drain Current @VGS=10V, TA=25°C Continuous Drain Current @VGS=10V, TA=70°C Pulsed Drain Current Total Power Dissipation (TA=25℃)
VDS VGS ID ID IDM Pd
30 ±20
6 4.8 20 *1 1.2 *2
Linear Derating Factor
0.016
Operating Junction and Storage Temperature Range
Tj, Tstg
-55~+150
Note : *1. Pulse width limited by safe operating area.
*2. Surface mounted on 1 in² copper pad of FR-4 board; 270 °C/W when mounted on min. copper pad.
Unit
V V A A A W W/ °C
°C
MTN2304M3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C737M3 Issued Date : 2012.07.26 Revised Date : 2013.08.12 Page No. : 2/8
Thermal Performance
Parameter
Symbol
Thermal Resistance, Junction-to-Ambient (Note )
Rth,ja
Note : Surface mounted on 1 in² copper pad of FR-4 board; 270 °C/W when mounted on min. copper pad.
Limit 104
Unit °C/W
Electrical Characteristics (Tj=25°C, unless otherwise noted)
Symbol
Min. Typ. Max. Unit
Test Conditions
S...