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NTD4904N

ON Semiconductor

Power MOSFET

www.DataSheet4U.com NTD4904N Power MOSFET Features 30 V, 79 A, Single N−Channel, DPAK/IPAK • • • • Low RDS(on) to Mini...



NTD4904N

ON Semiconductor


Octopart Stock #: O-652042

Findchips Stock #: 652042-F

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Description
www.DataSheet4U.com NTD4904N Power MOSFET Features 30 V, 79 A, Single N−Channel, DPAK/IPAK • • • • Low RDS(on) to Minimize Conduction Losses Low Capacitance to Minimize Driver Losses Optimized Gate Charge to Minimize Switching Losses These are Pb−Free Devices http://onsemi.com V(BR)DSS 30 V RDS(on) MAX 3.7 mW @ 10 V 5.5 mW @ 4.5 V D ID MAX 79 A
More View Applications • CPU Power Delivery • DC−DC Converters MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Parameter Drain−to−Source Voltage Gate−to−Source Voltage Continuous Drain Current (RqJA) (Note 1) Power Dissipation (RqJA) (Note 1) Continuous Drain Current (RqJA) (Note 2) Power Dissipation (RqJA) (Note 2) Continuous Drain Current (RqJC) (Note 1) Power Dissipation (RqJC) (Note 1) Pulsed Drain Current tp=10ms Current Limited by Package TA = 25°C TA = 100°C TA = 25°C TA = 25°C Steady State TA = 100°C TA = 25°C TC = 25°C TC = 100°C TC = 25°C TA = 25°C TA = 25°C PD IDM IDmaxPkg TJ, Tstg IS dV/dt EAS PD ID PD ID Symbol VDSS VGS ID Value 30 "20 17.8 12.6 2.6 13 9.2 1.4 79 56 52 316 90 − 55 to 175 47 6.0 68.4 W A A °C A V/ns mJ W A W A Unit V V A G S 4 4 1 2 N−Channel 4 3 1 CASE 369AA DPAK (Bent Lead) STYLE 2 2 3 CASE 369AD CASE 369D IPAK IPAK (Straight Lead) (Straight Lead DPAK) 2 3 1 MARKING DIAGRAMS & PIN ASSIGNMENTS 4 Drain YWW 49 04NG 4 Drain YWW 49 04NG 4 Drain Operating Junction and Storage Temperature Source Current (Body Diode) Drain to Source dV/dt Single Pulse Drain−to−Source Avalanche Energy (TJ = 25°C, VDD = 50 V, VGS = 10 V, L = 0.1 mH, IL(pk) = 37 A, RG = 25 W) Lead Temperature for Soldering Purposes (1/8″ from case for 10 s) 2 1 2 3 1 Drain 3 Gate Source Gate Drain Source 1 2 3 Gate Drain Source Y WW 4904N G = Year = Work Week = Device Code = Pb−Free Package TL 260 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. © Semiconductor Components Industries, LLC, 2009 June, 2009 − Rev. 0 1 Publication Order Number: NTD4904N/D YWW 49 04NG NTD4904N THERMAL RESISTANCE MAXIMUM RATINGS www.DataSheet4U.com Parameter Junction−to−Case (Drain) Junction−to−Tab (Drain) Junction−to−Ambient − Steady State (Note 1) Junction−to−Ambient − Steady State (Note 2) 1. Surface−mounted on FR4 board using 1 in sq pad size, 1 oz Cu. 2. Surface−mounted on FR4 board using the minimum recommended pad size. Symbol RqJC RqJC−TAB RqJA RqJA Value 2.9 4.3 57 108 Unit °C/W ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Parameter OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage






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