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NTLJD3181PZ

ON Semiconductor

Power MOSFET

NTLJD3181PZ Power MOSFET −20 V, −4.0 A,Dual P−Channel, ESD, 2x2 mm WDFN Package Features • WDFN 2x2 mm Package with Ex...


ON Semiconductor

NTLJD3181PZ

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Description
NTLJD3181PZ Power MOSFET −20 V, −4.0 A,Dual P−Channel, ESD, 2x2 mm WDFN Package Features WDFN 2x2 mm Package with Exposed Drain Pads for Excellent Thermal Conduction Lowest RDS(on) Solution in 2x2 mm Package Footprint Same as SC−88 Package Low Profile (< 0.8 mm) for Easy Fit in Thin Environments ESD Protected This is a Pb−Free Device Applications Optimized for Battery and Load Management Applications in Portable Equipment Li−Ion Battery Charging and Protection Circuits High Side Load Switch MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Parameter Symbol Value Unit Drain−to−Source Voltage VDSS −20 V Gate−to−Source Voltage VGS ±8.0 V Continuous Drain Current (Note 1) Steady TA = 25°C ID State TA = 85°C −3.2 A −2.3 t ≤ 5 s TA = 25°C −4.0 Power Dissipation (Note 1) Steady PD State TA = 25°C t ≤5 s 1.5 W 2.3 Continuous Drain Current (Note 2) Power Dissipation (Note 2) TA = 25°C ID Steady TA = 85°C State TA = 25°C PD −2.2 A −1.6 0.71 W Pulsed Drain Current tp = 10 ms IDM −16 A Operating Junction and Storage Temperature TJ, TSTG −55 to °C 150 Source Current (Body Diode) (Note 2) Lead Temperature for Soldering Purposes (1/8″ from case for 10 s) IS −1.0 A TL 260 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Surface Mounted on FR4 Board ...




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