PACDN1416C

CALIFORNIA MICRO DEVICES PACDN1404C PACDN1408C PACDN1416C ESD Protection Arrays, Chip Scale Package Features 4, 8, or 16 transient voltage suppressors in a single package In-system Electrostatic Discharge (ESD) protection to 25kV contact discharge per IEC 61000-4-2 international standard Compact Chip Scale Package (0.65mm pitch) format saves board space and eases layout in space critical applications compared to discrete solutions and traditional wire bonded packages Applications ESD protection of I/O port connections, such as cellular phone, PDA, internet appliance and PC ports Protection of interface ports or IC pins which are exposed to high levels of ESD Product Description The PACDN1404C, PACDN1408C and PACDN1416C are transient voltage suppressor arrays that provide a very high level of protection for sensitive electronic components that may be subjected to ESD. These devices are designed and characterized to safely dissipate ESD strikes at levels well beyond the maximum requirements set forth in the IEC 61000-4-2 international standard (Level 4, 8kV contact discharge). All I/Os are rated at 25kV using the IEC 61000-4-2 contact discharge method. Using the MIL-STD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than 30kV. The Chip Scale Package format of these devices enable extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet ...