Q62702-A911 Datasheet


Part Number

Q62702-A911

Description

Silicon Switching Diodes (Switching applications High breakdown voltage)

Manufacture

Siemens Semiconductor Group

Total Page 3 Pages
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Features Datasheet pdf Silicon Switching Diodes BAS 78 A … B AS 78 D Switching applications q High breakdown voltage q Type BAS 78 A BAS 78 B BAS 78 C BAS 78 D Marking BAS 78 A BAS 78 B BAS 78 C BAS 78 D Ordering Code (tape and reel) Q62702-A910 Q62702 -A911 Q62702-A912 Q62702-A913 Pin Conf iguration Package1) SOT-223 Maximum R atings Parameter Symbol BAS 78 A Revers e voltage Peak reverse voltage Forward current Peak forward current Surge forw ard current, t = 1 µs Total power diss ipation, TS = 124 ˚C2) Junction temper ature Storage temperature range Thermal Resistance Junction - ambient2) Juncti on - soldering point Rth JA Rth JS ≤ ≤ Values BAS BAS 78 B 78 C 100 100 1 1 10 1.2 150 – 65 … + 150 200 200 Unit BAS 78 D 400 400 A V VR VRM IF I FM IFS Ptot Tj Tstg 50 50 W ˚C 92 2 2 K/W 1) 2) For detailed information see chapter Package Outlines. Package mounted on epoxy pcb 40 mm × 40 mm × 1.5 mm/6 cm2 Cu. Semiconductor Group 1 5.91 BAS 78 A … BAS 78 D Electrical Characteristics at TA = 25 ˚C, unless.
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Q62702-A911 Datasheet
Silicon Switching Diodes
q Switching applications
q High breakdown voltage
BAS 78 A
… BAS 78 D
Type
BAS 78 A
BAS 78 B
BAS 78 C
BAS 78 D
Marking
BAS 78 A
BAS 78 B
BAS 78 C
BAS 78 D
Ordering Code
(tape and reel)
Q62702-A910
Q62702-A911
Q62702-A912
Q62702-A913
Pin Configuration
Package1)
SOT-223
Maximum Ratings
Parameter
Symbol
Reverse voltage
Peak reverse voltage
Forward current
Peak forward current
Surge forward current, t = 1 µs
Total power dissipation, TS = 124 ˚C2)
Junction temperature
Storage temperature range
VR
VRM
IF
IFM
IFS
Ptot
Tj
Tstg
BAS
78 A
50
50
Values
BAS BAS
78 B 78 C
100 200
100 200
1
1
10
1.2
150
– 65 … + 150
BAS
78 D
400
400
Unit
V
A
W
˚C
Thermal Resistance
Junction - ambient2)
Junction - soldering point
Rth JA
Rth JS
92 K/W
22
1) For detailed information see chapter Package Outlines.
2) Package mounted on epoxy pcb 40 mm × 40 mm × 1.5 mm/6 cm2 Cu.
Semiconductor Group
1
5.91




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