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MOSFET. S10H06R Datasheet |
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SI-TECH SEMICONDUCTOR CO.,LTD
S10H06R/S
N-Channel MOSFET
Features
█ 100V,60A,Rds(on)(typ)=15mΩ @Vgs=10V
█ High Ruggedness
█ Fast Switching
█ 100% Avalanche Tested
█ Improved dv/dt Capability
General Description
This Power MOSFET is produced using Si-Tech’s advanced
Trench MOS Technology. This latest technology has been
especially designed to minimize on-state resistance, have a
high rugged avalanche characteristics.These devices are well
suited for low voltage application such as automotive,DC/DC
converters,and high efficiency switch for power management
in portable and battery products.
Absolute Maximum Ratings
Symbol
Parameter
VDSS
ID
IDM
VGS
EAS
PD
TJ
TSTG
Drain-Source Voltage
Continuous Drain Current (TC=25 ℃)
Continuous Drain Current (TC=100℃)
Pulsed Drain Current (Note 1)
Gate-Source Voltage
Single Pulsed Avalanche Energy (Note 2)
Maximum Power Dissipation (TC=25 ℃)
Derating Factor above 25℃
Operating Junction Temperature Range
Storage Temperature Range
Thermal Characteristics
Symbol
Rth j-c
Rth j-a
Parameter
Thermal Resistance, Junction to case
Thermal Resistance, Junction to Ambient
R:T0220
S:TO263
Value
100
60
48
198
±25
400
176
1.17
-55 to +175
-55 to +175
Max.
0.77
63
Units
V
A
A
A
V
mJ
W
W/℃
℃
℃
Units
℃/W
℃/W
- 1 - Mar.2016
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SI-TECH SEMICONDUCTOR CO.,LTD
S10H06R/S
Electrical Characteristics (TC=25℃ unless otherwise noted)
Symbol
Parameter
Test Conditions
BVDSS
IDSS
IGSS
VGS(th)
RDS(on)
Qg
Qgs
Qgd
t d(on)
tr
t d(off)
tf
Ciss
Coss
Crss
Drain-Source Breakdown Voltage
Drain-Source Leakage Current
Gate Leakage Current, Forward
Gate Leakage Current, Reverse
Gate Threshold Voltage
Drain-Source On-State Resistance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-on Delay Time
Turn-on Rise Time
Turn-off Delay Time
Turn-off Fall Time
Input Capacitance -
Output Capacitance
Reverse Transfer Capacitance
VGS=0V, ID=250uA
VDS=75V, VGS=0V
VGS=25V, VDS=0V
VGS=-25V, VDS=0V
VGS=VDS, ID=250uA
VGS=10V, ID=40A
VDD=60V
VGS=10V
ID=80A
(Note 3)
VDD=37.5V,VGS=10V
ID=45A,RG=4.7Ω
TC=25 ℃
(Note 3)
VDS=25V
VGS=0V
f = 1MHz
Min. Typ. Max. Units
100 -
-V
- - 1 uA
- - 100 nA
- - -100 nA
2.5 - 3.5 V
- 15 17 m Ω
- 94 - nC
- 15 - nC
- 23 - nC
- 25 - ns
- 22 - ns
- 57 - ns
- 44 - ns
- 4200 -
pF
- 270 - pF
- 150 - pF
Source-Drain Diode Characteristics (TC=25℃ unless otherwise noted)
Symbol
Parameter
Test Conditions
IS Continuous Source Diode Forward Current
ISM Pulsed Source Diode Forward Current (Note 1)
VSD Forward On Voltage
VGS=0V, IS=45A
tr r Reverse Recovery Time
Qr r Reverse Recovery Charge
VGS=0V, IS=45A
dIF/dt = 100A/us
Notes：
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. L=0.5mH, VDD=50V, RG=25 , Starting TJ=25℃
3. Pulse Width ≤ 300 us; Duty Cycle≤2%
Min. Typ. Max. Units
- - 60 A
- - 198 A
- - 1.2 V
- 50 - ns
- 130 - nC
- 2 - Mar.2016
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SI-TECH SEMICONDUCTOR CO.,LTD
S10H06R/S
Typical Characteristics
Output Characteristics
Drain Current
VDS - Drain-Source Voltage (V)
Safe Operation Area
T j- Junction Temperature (°C)
Thermal Transient Impedance
V DS- Drain-Source Voltage (V)
-3-
Square Wave Pulse Duration (sec)
Mar.2016
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