AXIS GYROSCOPE. SCR1100-D02 Datasheet

SCR1100-D02 Datasheet PDF


Part Number

SCR1100-D02

Description

SINGLE AXIS GYROSCOPE

Manufacture

VTI technologies

Total Page 21 Pages
Datasheet
Download SCR1100-D02 Datasheet


SCR1100-D02
Data Sheet
Doc.Nr. 82 1130 00 A
SCR1100-D02 SINGLE AXIS GYROSCOPE WITH DIGITAL SPI INTERFACE
Features
±100 º/s angular rate measurement range
Angular rate measurement around X axis
Angular rate sensor exceptionally insensitive to
mechanical vibrations and shocks
Superior bias instability for MEMS gyroscopes
(<1º/h)
Digital SPI interfacing
Enhanced self diagnostics features
Small size 8.5 x 18.7 x 4.5 mm (w x l x h)
RoHS compliant robust packaging suitable for
lead free soldering process and SMD mounting
Proven capacitive 3D-MEMS technology
Temperature range -40 °C...+125 °C
Applications
SCR1100-D02 is targeted to applications with high
stability and tough environmental requirements. Typical
applications are:
Inertial Measurement Units (IMUs) for highly
demanding environments
Platform stabilization and control
Motion analysis and control
Roll over detection
Robotic control systems
Guidance systems
Navigation systems
General Description
SCR1100-D02 is a single axis high performance gyroscope. It is part of VTI's high performance gyro family and it has the
same gyro section as the combined gyro acceleration product SCC1300-D02. The sensor is based on VTI's proven
capacitive 3D-MEMS technology and it has highly sophisticated signal conditioning ASIC with digital SPI interface. Small
robust packaging guarantees reliable operation over product lifetime. The housing is suitable for SMD mounting and the
component is compatible with RoHS and ELV directives.
SCR1100-D02 is designed, manufactured and tested against high stability, reliability and quality requirements. The
angular rate sensor provides highly stable output over wide ranges of temperature and mechanical noise. The bias
stability is in the elite of MEMS gyros and the component has several advanced self diagnostics features.

SCR1100-D02
SCR1100-D02
TABLE OF CONTENTS
1 General Description .........................................................................................3
1.1 Introduction ..................................................................................................................................3
1.2 General Product Description ......................................................................................................3
1.2.1 Factory Calibration................................................................................................................4
1.3 Abbreviations ...............................................................................................................................4
2 Specifications...................................................................................................5
2.1 Performance Specifications for Gyroscope ..............................................................................5
2.2 Absolute Maximum Ratings........................................................................................................6
2.3 Digital I/O Specification...............................................................................................................6
2.4 SPI AC Characteristics ................................................................................................................7
3 Reset and Power Up ........................................................................................8
3.1 Power-up Sequence.....................................................................................................................8
3.2 Reset .............................................................................................................................................8
4 Component Interfacing ....................................................................................8
4.1 SPI Interfaces ...............................................................................................................................8
4.1.1 SPI Transfer ...........................................................................................................................8
4.1.2 SPI Transfer Parity Mode....................................................................................................10
4.2 ASIC Addressing Space ............................................................................................................11
4.2.1 Register Definition ..............................................................................................................11
4.2.2 Data Register Block ............................................................................................................11
4.2.3 Temperature Output Registers ..........................................................................................12
4.3 Pin Description...........................................................................................................................13
4.4 Application Circuitry and External Component Characteristics ...........................................14
4.4.1 Separate Analog and Digital Ground Layers with Long Power Supply Lines ...............15
4.5 Boost Regulator and Power Supply Decoupling in Layout ...................................................16
4.5.1 Layout Example...................................................................................................................17
4.5.2 Thermal Connection............................................................................................................17
4.6 Measurement Axis and Directions ...........................................................................................18
4.7 Package Characteristics ...........................................................................................................19
4.7.1 Package Outline Drawing ...................................................................................................19
4.7.2 PCB Footprint ......................................................................................................................20
4.8 Assembly instructions ..............................................................................................................20
5 Contact Information .......................................................................................21
VTI Technologies Oy
www.vti.fi
Subject to changes
Doc.Nr. 82 1130 00 A
2/21
Rev. 1.0





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