SEAM-50 Datasheet - HIGH-SPEED/HIGH-DENSITY OPEN-PIN-FIELD

F-219 SEAM – 30 – 02 .0 – S – 08 –2 –A– K–TR SEAM –20 – 02 .0 – S –10 –2 –A– K–TR SEAM – 30 – 03.5 – S – 04 –2 –A– K–...

F-219 SEAM – 30 – 02 .0 – S – 08 –2 –A– K–TR SEAM –20 – 02 .0 – S –10 –2 –A– K–TR SEAM – 30 – 03.5 – S – 04 –2 –A– K–TR (1.27 mm) .050" SEAM SERIES HIGH-SPEED/HIGH-DENSITY OPEN-PIN-FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?SEAM Insulator Material: Black LCP Contact Material: Copper Alloy Operating Temp Range: -55 °C to +125 °C Current Rating (7 mm stack height): 2.7 A per pin (10 adjacent pins powered) Plating: Au or Sn over 50 µ" (1.27 µm) Ni Working Voltage: 240 VAC RoHS Compliant: Yes Lead-Free Solderable: Yes RECOGNITIONS For complete scope of recognitions see www.samtec.com/quality FILE NO. E111594 Mates with: SEAF, SEAFP Standoffs: JSO (1.12 mm) .044" NOMINAL WIPE Up to 500 Pins 10 YEAR MFG WITH 30 µ" GOLD EXTENDED LIFE PRODUCT HIGH MATING CYCLES Low insertion/ extraction forces HIGH-SPEED CHANNEL PERFORMANCE Solder charges SEAF/SEAM @ 10 mm Mated Stack Height ...