One Component High Thermal Conductive Grease
SI1101
Technical Data Sheet
One Component High Thermal Conductive Grease
SI1101
◆Detailed Product Description
Features...
Description
SI1101
Technical Data Sheet
One Component High Thermal Conductive Grease
SI1101
◆Detailed Product Description
Features
1. SI1101 is produced by imported raw material and formula, composed by organo-siloxane and metallic
oxide which with good thermal conductivity and insulativity. So the grease has fabulous thermal
conductivity and insulativity. 2. It has high stability from -50℃ to +200℃ 3. The viscosity is low and it’s easy to application. 4. Non-poisonous, no corrosion, no smell, won’t dry and solute 5. High Thermal conductivity, 1.5W/(m·K) 6. Low Bleed, ≤2.0% in 8 hours and 200℃ 7. Good temperature resistance, no harden and flowing in 200℃
Usage
Widely used as thermal transmission medium among electronic components, such as the shimming of CPU and radiator, gap filling of triac semiconductor diode and basic material(aluminum or copper etc.) for reducing the work temperature of heater element.
Model number
Appearance Penetration(1/100mm)
Density(g/cm3) Bleed(%,200℃/8hr) Volatility (%,200℃/8hr) Thermal Conductivity(W/m.K)
◆Data Table
SI 1101
White Paste 300 2.2
≤ 3. 0 ≤ 2.2
1.5
Note: ①All data above were tested under standardized condition. ②All data listed in the chart were for the generalized item in the series; please refer to the related data sheet for special items. ③Storage condition has a direct impact to the products’ shelf life, Please refer to the instruction for special items’ storing.
Version 1.02 / 2014-05 /SEPUNA
SEPUNA CHEMICALS
Hotline:400-882-1323
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