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SIGC101T170R3
IGBT Chip
FEATURES: • 1700V Trench + Field Stop technology • low turn-off losses • sh...
www.DataSheet4U.com
SIGC101T170R3
IGBT Chip
FEATURES: 1700V Trench + Field Stop technology low turn-off losses short tail current positive temperature coefficient easy paralleling
3
This chip is used for: power module
C
Applications: drives
G
E
Chip Type SIGC101T170R3
VCE 1700V
ICn 75A
Die Size 10.03 x 10.03 mm2
Package sawn on foil
Ordering Code Q67050A4188-A001
MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metalization Collector metalization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 10.03 x 10.03 8 x ( 3.82 x 1.75 ) 1.18 x 1.09 100.6 / 75.3 190 150 90 136 pcs Photoimide 3200 nm AlSiCu 1400 nm Ni Ag –system suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al, <500µm ∅ 0.65mm ; max 1.2mm store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C mm µm mm grd
2
mm
Edited by INFINEON Technologies AI PS DD HV3, L 7771-A, Edition 2, 04.09.03
SIGC101T170R3
MAXIMUM RATINGS: Parameter Collector-emitter
voltage, Tj=25 °C DC collector current, limited by Tjmax Pulsed collector current, tp limited by Tjmax Gate emitter
voltage Operating junction and storage temperature
1)
Symbol V CE IC Icpuls V GE Tj, Ts t g
Value 1700
1)
Unit V A A V °C
225 ±20 -55 ... +150
depending on thermal properties of assembly
STATIC CHARACTERISTICS...