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SIGC25T60NC IGBT Datasheet PDF

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Part Number SIGC25T60NC
Description IGBT
Feature www.
DataSheet4U.
com SIGC25T60NC IGBT Ch ip in NPT-technology FEATURES:
• 600V NPT technology
• 100µm chip
• pos itive temperature coefficient
• easy paralleling C This chip is used for: IGBT Modules Applications:
• drive s G E Chip Type SIGC25T60NC VCE 600 V ICn 30A Die Size 4.
5 x 5.
71 mm2 Pa ckage sawn on foil Ordering Code Q6705 0-A4143A001 MECHANICAL PARAMETER: Rast er size Area total / active Emitter pad size Gate pad size Thickness Wafer siz e Flat position Max.
possible chips per wafer Passivation frontside Emitter met allization Collector metallization Die bond Wire bond Reject Ink D .
Manufacture Infineon Technologies
Datasheet
Download SIGC25T60NC Datasheet

SIGC25T60NC

 

 

 


 

 

 

Part Number SIGC25T60NC
Description IGBT
Feature www.
DataSheet4U.
com SIGC25T60NC IGBT Ch ip in NPT-technology FEATURES:
• 600V NPT technology
• 100µm chip
• pos itive temperature coefficient
• easy paralleling C This chip is used for: IGBT Modules Applications:
• drive s G E Chip Type SIGC25T60NC VCE 600 V ICn 30A Die Size 4.
5 x 5.
71 mm2 Pa ckage sawn on foil Ordering Code Q6705 0-A4143A001 MECHANICAL PARAMETER: Rast er size Area total / active Emitter pad size Gate pad size Thickness Wafer siz e Flat position Max.
possible chips per wafer Passivation frontside Emitter met allization Collector metallization Die bond Wire bond Reject Ink D .
Manufacture Infineon Technologies
Datasheet
Download SIGC25T60NC Datasheet

SIGC25T60NC

 

 

 

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