SKCD 09 C 060 I3
Absolute Maximum Ratings Symbol
VRRM IF(AV) IFSM Tjmax
Conditions
Tj = 25 °C, IR = 0.1 mA Ts = 80 °C, ...
SKCD 09 C 060 I3
Absolute Maximum Ratings Symbol
VRRM IF(AV) IFSM Tjmax
Conditions
Tj = 25 °C, IR = 0.1 mA Ts = 80 °C, Tj = 150 °C 10 ms sin 180° Tj = 25 °C Tj = 150 °C
Values
600 15 120 100 150
Unit
V A A A °C
CAL-DIODE
IF = 20 A VRRM = 600 V Size: 2,95 mm x 2,95 mm
SKCD 09 C 060 I3
Electrical Characteristics Symbol
i2t IR VF V(TO) rT
Conditions
Tj = 150 °C, 10 ms, sin 180° Tj = 25 °C, VRRM = 600 V Tj = 125 °C, VRRM = 600 V Tj = 25 °C, IF = 15 A Tj = 125 °C, IF = 15 A Tj = 125 °C Tj = 125 °C
min.
typ.
max.
50 0.10 0.50
Unit
A2s mA mA V V V mΩ
1.35 1.35 0.90 33.0
1.60 1.60
Features
low forward
voltage drop combined with a low temperature dependence easy paralleling due to a small forward
voltage spread very soft recovery behavior small switching losses high ruggedness compatible to thick wire bonding compatible to all standard solder processes
Dynamic Characteristics Symbol
trr trr Qrr Qrr Irrm Irrm
Conditions
Tj = 25 °C, 10 A, 300 V, 200 A/µs Tj = 125 °C, 10 A, 300 V, 200 A/µs Tj = 25 °C, 10 A, 300 V, 200 A/µs Tj = 125 °C, 10 A, 300 V, 200 A/µs Tj = 25 °C, 10 A, 300 V, 200 A/µs Tj = 125 °C, 10 A, 300 V, 200 A/µs
min.
typ.
max.
Unit
µs ns
0.8 1.2 8
µC µC A A
Typical Applications*
freewheeling diode for IGBT
Thermal Characteristics Symbol
Tj Tstg Tsolder Tsolder Rth(j-s) 10 min. 5 min. sold. on 0,38 mm DCB, reference point on copper heatsink close to the chip 2.11
Conditions
min.
-40 -40
typ.
max.
150 150 250 320
Unit
°C °C °C °C K/W...