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• Controlled Baseline
– One Assembly/Test Site, One Fabrication Site
• Enhanced Diminishing Manufact...
www.ti.com
FEATURES
Controlled Baseline
– One Assembly/Test Site, One Fabrication Site
Enhanced Diminishing Manufacturing Sources (DMS) Support
Enhanced Product-Change Notification Qualification Pedigree (1) Member of the Texas Instruments
Widebus™ Family
State-of-the-Art EPIC-IIB™ Bi
CMOS Design Significantly Reduces Power Dissipation
Typical VOLP (Output Ground Bounce) <1 V at VCC = 5 V, TA = 25°C
High-Impedance State During Power Up and Power Down
Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
Flow-Through Architecture Optimizes PCB Layout
High-Drive Outputs (–32-mA IOH, 64-mA IOL) Latch-Up Performance Exceeds 500 mA Per
JESD 70
ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
Shrink Small-Outline (DL) Package
(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
SN74ABT16245A-EP 16-BIT BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCBS807B – OCTOBER 2005 – REVISED JANUARY 2006
DL PACKAGE (TOP VIEW)
1DIR 1 1B1 2 1B2 3 GND 4 1B3 5 1B...