SN74ABT623

D State-of-the-Art EPIC-ΙΙB™ BiCMOS Design Significantly Reduces Power Dissipation D ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) D Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 D Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C D High-Drive Outputs (–32-mA IOH, 64-mA IOL) D Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Ceramic Flat (W) Package, and Plastic (N) and Ceramic (JT) DIPs SN54ABT623A, SN74ABT623 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS114D – FEBRUARY 1991 – REVISED MAY 1997 SN54ABT623A . . . JT OR W PACKAGE SN74ABT623 . . . DB, DW, N, OR PW PACKAGE (TOP VIEW) OEAB 1 A1 2 A2 3 A3 4 A4 5 A5 6 A6 7 A7 8 A8 9 GND 10 20 VCC 19 OEBA 18 B1 17 B2 16 B3 15 B4 14 B5 13 B6 12 B7 11 B8 SN54ABT623A . . . FK PACKAGE (TOP VIEW) A2 A1 OEAB VCC OEBA description The SN54ABT623A and SN74ABT623 bus transceivers are designed for asynchronous communication between data buses. The control-function implementation allows for maximum flexibility in timing. The SN54ABT623A and SN74ABT623 provide true data at their outputs. A3 3 2 1 20 19 4 18 B1 A4 5 17 B2 A5 6 16 B3 A6 7 15 B4 A7 8 14 B5 9 10 11 12 13 A8 GND B8 B7 B6 These devices allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic levels at the outpu...