SSC-AM101

*Customer: SPECIFICATION ITEM MODEL Revision Date www.DataSheet4U.com CHIP LED DEVICE SSC-AM101 Rev0.0(040101) [Contents] 1. Features 2. Absolute maximum ratings 3. Electro-optical characteristics 4. Characteristic diagram 5. Soldering profile 6. Outline dimension 7. Packing 8. Reel packing structure 9. Precaution for use Drawn by Checked by Approved by SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 SSC-AM101 Seoul Semiconductor - 1/7 - 1. Features Package : 1.6×0.8×0.8mm Untinted, Diffused flat mold Wavelength : 605㎚ 2. Absolute Maximum Ratings Parameter Power Dissipation Symbol Pd IF IFM*1 VR Topr Tstg Value 75 30 50 5 -40 ~ 85 -40 ~ 100 (Ta=25℃) Unit ㎽ ㎃ ㎃ V ℃ ℃ www.DataSheet4U.com Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature *1 IFM conditions: Pulse width Tw≤ 0.1ms and Duty ratio≤ 1/10 3. Electro-Optical Characteristics Parameter Forward Voltage Reverse Current Luminous Intensity*2 Wavelength Spectral Bandwidth Viewing angle*3 Symbol VF IR IV λ p (Ta=25℃) Condition IF=20㎃ VR=5V IF=20㎃ IF=20㎃ IF=20㎃ IF=20㎃ Min 1.8 10 600 Typ 2.0 18 605 30 120 Max 2.5 10 615 Unit V ㎂ mcd ㎚ ㎚ ˚ Δλ 2θ 1/2 *2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. *3 θ 1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity. [Note...