SSCE5V032D3
SSCE5V032D3 Lo BVV
Low-Capacitance Bidirectional Micro Packaged TVS Diodes for ESD Protection
Description
PIN configuration
The SSCE5V032D3 is designed with Panjing Punch-Through process TVS technology to protect voltage sensitive components from ESD. Excellent clamping capability,low leakage,and fast response time provide best in class protection on designs that are exposed to ESD.Because of its small size,it is suited for use in cellular phones,MP3 players,digital cameras a.
TVS Diodes
SSCE5V032D3
SSCE5V032D3 Lo BVV
Low-Capacitance Bidirectional Micro Packaged TVS Diodes for ESD Protection
Description
PIN configuration
The SSCE5V032D3 is designed with Panjing Punch-Through process TVS technology to protect voltage sensitive components from ESD. Excellent clamping capability,low leakage,and fast response time provide best in class protection on designs that are exposed to ESD.Because of its small size,it is suited for use in cellular phones,MP3 players,digital cameras and many other portable applications where board space comes at a premium.Also because of its low capacitance,it is suited for use in high frequency designs such as USB 2.0 high speed,VGA,DVI,SDI and other high speed line applications.
It has been specifically designed to protect sensitive components which are connected to data and transmission lines from overvoltage caused by ESD(electrostatic discharge),and EFT(electrical fast transients).
Applications High Speed Line:USB1.0/2.0,VG.