SSF4624

SSF4624 DESCRIPTION The SSF4624 uses advanced trench technology to provide excellent RDS(ON) and low gate charge .This device is suitable for use as a load switch or in PWM applications. GENERAL FEATURES ● VDS = 40V,ID =6A RDS(ON) < 45mΩ @ VGS=4.5V RDS(ON) < 31mΩ @ VGS=10V ● High Power and current handing capability ● Lead free product is acquired ● Surface Mount Package Schematic diagram Marking and pin Assignment Application ●PWM applications ●Load switch ●Power management PACKAGE MARKING AND ORDERING INFORMATION Device Marking Device Device Package Reel Size SSF4624 SSF4624 SOP-8 Ø330mm SOP-8 top view Tape width 12mm Quantity 3000 units ABSOLUTE MAXIMUM RATINGS(TA=25℃unless otherwise noted) Parameter Symbol Drain-Source Voltage VDS Gate-Source Voltage VGS ID（25℃） Drain Current-Continuous@ Current-Pulsed (Note 1) ID（70℃） IDM Maximum Power Dissipation PD Operating Junction and Storage Temperature Range TJ,TSTG Limit 40 ±20 6 5 20 2 -55 To 150 Unit V V A A A W ℃ THERMAL CHARACTERISTICS Thermal Resistance,Junction-to-Ambient (Note 2) RθJA 62.5 ℃/W ELECTRICAL CHARACTERISTICS (TA=25℃unless otherwise noted) Parameter Symbol Condition OFF CHARACTERISTICS Drain-Source Breakdown Voltage BVDSS VGS=0V ID=250μA Zero Gate Voltage Drain Current IDSS VDS=32V,VGS=0V Min Typ Max 40 1 Unit V μA ©Silikron Semiconductor CO.,LTD. 1 http://www.silikron.com v1.0 SSF4624 Gate-Body Leakage Current ON CHARACTERISTICS (Note 3) Gate Threshold Voltag...