N-CHANNEL POWER MOSFET
FEATURES
• Avalanche Rugged Technology • Rugged Gate Oxide Technology • Lower Input Capacitance ...
N-CHANNEL POWER
MOSFET
FEATURES
Avalanche Rugged Technology Rugged Gate Oxide Technology Lower Input Capacitance Improved Gate Charge Extended Safe Operating Area Lower Leakage Current: 25µA (Max.) @ VDS = 800V Lower RDS(ON): 1.000Ω (Typ.)
ABSOLUTE MAXIMUM RATINGS
Symbol VDSS
ID
IDM VGS EAS IAR EAR dv/dt
PD
TJ, TSTG
TL
Characteristics
Drain-to-Source
Voltage
Continuous Drain Current (TC = 25°C)
Continuous Drain Current (TC = 100°C)
Drain Current-Pulsed
x
Gate-to-Source
Voltage
Single Pulsed Avalanche Energy
y
Avalanche Current
x
Repetitive Avalanche Energy
x
Peak Diode Recovery dv/dt
z
Total Power Dissipation (TC = 25°C) Linear Derating Factor
Operating Junction and Storage Temperature Range
Maximum Lead Temp. for Soldering Purposes, 1/8” from case for 5-seconds
THERMAL RESISTANCE
Symbol
RθJC RθCS RθJA
Characteristics Junction-to-Case
Case-to-Sink Junction-to-Ambient
SSH8N80A
BVDSS = 800V RDS(ON) = 1.5Ω ID = 8A
TO-3P
1 2 3
1. Gate 2. Drain 3. Source
Value 800
8 5.1 32 ±30 444 8 24 2.0 240 1.92
−55 to +150
300
Units V
A
A V mJ A mJ V/ns W W/°C
°C
Typ. −
0.24 −
Max. 0.52
− 40
Units °C/W
1999 Fairchild Semiconductor Corporation
REV. B
1
SSH8N80A
N-CHANNEL POWER
MOSFET
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise specified)
Symbol BVDSS ∆BV/∆TJ VGS(th)
IGSS
Characteristics Drain-Source Breakdown
Voltage Breakdown
Voltage Temp. Coeff. Gate Threshold
Voltage Gate-Source Leakage, Forward Gate-Source Leakage, Reverse
...