TMP006B

Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TMP006, TMP006B SBOS518E – MAY 2011 – REVISED APRIL 2015 TMP006/B Infrared Thermopile Sensor in Chip-Scale Package 1 Features 1 Integrated MEMs Thermopile for Noncontact Temperature Sensing Local Temperature Sensor for Cold Junction Reference – ±1°C (max) from 0°C to 60°C – ±1.5°C (max) from –40°C to +125°C Two-Wire Serial Interface Options: – I2C and SMBus Compatible – TMP006 at 3.3 V – TMP006B at 1.8 V – Eight Programmable Addresses Low Power – Supply: 2.2 V to 5.5 V – Active Current: 240 μA (typ) – 1-µA shutdown (max) Compact Package – 1.6-mm × 1.6-mm × 0.625-mm DSBGA 2 Applications Noncontact Temperature Sensing – Case Temperature – Laser Printers – Power Relays – Health and Beauty – HVAC Comfort Optimization Gas Concentration Flame Detection 3 Description The TMP006 and TMP006B are fully integrated MEMs thermopile sensors that measure the temperature of an object without having to be in direct contact. The thermopile absorbs passive infrared energy from an object at wavelengths between 4 um to 16 um within the end-user defined field of view. The corresponding change in voltage across the thermopile is digitized and reported with the on-chip die thermal sensor measurement through an I2C- and SMBus-compatible interface. With this data, the target object temperature can be calculated by an external processor. The TMP007 is an enhanced version of the TMP006 or TMP006B. ...