D CMOS/EEPROM/EPROM Technologies on a
Single Device – Mask-ROM Devices for High-Volume
Production – One-Time-Programmabl...
D
CMOS/EEPROM/EPROM Technologies on a
Single Device – Mask-ROM Devices for High-Volume
Production – One-Time-Programmable (OTP) EPROM
Devices for Low-Volume Production – Reprogrammable EPROM Devices for
Prototyping Purposes
D Internal System Memory Configurations
– On-Chip Program Memory Versions – ROM: 4K to 48K Bytes – EPROM: 16K to 48K Bytes – ROM-less
– Data EEPROM: 256 or 512 Bytes – Static RAM: 256 to 3.5K Bytes – External Memory / Peripheral Wait States – Precoded External Chip-Select Outputs
in Microcomputer Mode
D Flexible Operating Features
– Low-Power Modes: STANDBY and HALT – Commercial, Industrial, and Automotive
Temperature Ranges – Clock Options
– Divide-by-4 (0.5 MHz – 5 MHz SYSCLK) – Divide-by-1 (2 MHz – 5 MHz SYSCLK)
Phase-Locked Loop (PLL) – Supply
Voltage (VCC): 5 V ± 10%
D Eight-Channel 8-Bit Analog-to-Digital
Converter 1 (ADC1)
D Two 16-Bit General-Purpose Timers D On-Chip 24-Bit Watchdog Timer D Two Communication Modules
– Serial Communications Interface 1 (SCI1) – Serial Peripheral Interface (SPI)
D Flexible Interrupt Handling D TMS370 Series Compatibility D
CMOS/Package /TTL-Compatible I / O Pins
– 64-Pin Plastic and Ceramic Shrink Dual-In-Line Packages / 44 Bidirectional, 9 Input Pins
– 68-Pin Plastic and Ceramic Leaded Chip Carrier Packages / 46 Bidirectional, 9 Input Pins
– All Peripheral Function Pins Are Software Configurable for Digital I / O
TMS370Cx5x 8-BIT MICROCONTROLLER
SPNS010F – DECEMBER 1986 – REVISED FEBRUARY 1997
FN / FZ PACKAGE ( TOP...