www.vishay.com
VSKY02300603
Vishay Semiconductors
Small Signal Schottky Diode FlipKY® Gen 2
X
DESIGN SUPPORT TOOLS AVAILABLE
3D 3D
3D Models
Models
Related Documents
Footprints
FEATURES
• Schottky diode for high-speed switching
• Very low dimensions: 0.6 mm x 0.3 mm x 0.29 mm
• 0.2 A forward current
• Low forward voltage drop (typ. 435 mV at 0.2 A)
• Low reverse current (< 3 μA at 10 V)
• Material categorization: for definitions of compliance www.vishay.com/doc?99912
.
Small Signal Schottky Diode
www.vishay.com
VSKY02300603
Vishay Semiconductors
Small Signal Schottky Diode FlipKY® Gen 2
X
DESIGN SUPPORT TOOLS AVAILABLE
3D 3D
3D Models
Models
Related Documents
Footprints
FEATURES
• Schottky diode for high-speed switching
• Very low dimensions: 0.6 mm x 0.3 mm x 0.29 mm
• 0.2 A forward current
• Low forward voltage drop (typ. 435 mV at 0.2 A)
• Low reverse current (< 3 μA at 10 V)
• Material categorization: for definitions of compliance www.vishay.com/doc?99912
please
see
PARTS TABLE
PART
ORDERING CODE
CIRCUIT CONFIGURATION
PACKAGE NAME
TYPE MARKING
WEIGHT
TAPED UNITS PER REEL (8 mm TAPE ON 7" REEL)
MINIMUM ORDER
QUANTITY
VSKY02300603 VSKY02300603-G4-08
Single
CLP0603-2M 23 0.115 mg
15 000
15 000
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
Reverse voltage
VR
Forward continuous current
IF
Surge forward current
8.3 ms half sine-wave
IFSM
Power dissipation
Footprint acc. Fig. 4 Infinite heat sink
Ptot
VALUE 30 200 6 278
1712
UNIT V mA A
mW
THERMAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
Thermal resistance junction to ambient air
Acc. JEDEC® 51-3 with footprint acc. Fig. 4
Thermal resistance junction to soldering point
Infinite heat sink
Maximum operating junction temperature
Storage temperature range
SYMBOL RthJA RthJS Tj Tstg
VALUE 450 73 150
-65 to +150
UNIT K/W
°C
ELECTRICAL CHARACTERISTICS (Tamb = 25.