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WS128K32-XG2UX

Microsemi

128Kx32 SRAM

WS128K32-XXX 128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595 FEATURES  Access Times of 15, 17, 20, 25, 35, 45, 55ns...


Microsemi

WS128K32-XG2UX

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Description
WS128K32-XXX 128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595 FEATURES  Access Times of 15, 17, 20, 25, 35, 45, 55ns  MIL-STD-883 Compliant Devices Available  Packaging 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP (Package 400) 68 lead, 40mm CQFP (G4T)1, 3.56mm (0.140") (Package 502) 68 lead, 22.4mm CQFP (G2U), 3.56mm (0.140"), (Package 510) 68 lead, 22.4mm (0.880") square, CQFP (G2L), 5.08mm (0.200") high, (Package 528)  Organized as 128Kx32; User Configurable as 256Kx16 or 512Kx8  Commercial, Industrial and Military Temperature Ranges  5 Volt Power Supply  Low Power CMOS  TTL Compatible Inputs and Outputs  Built in Decoupling Caps and Multiple Ground Pins for Low Noise Operation  Weight: WS128K32-XG2UX - 8 grams typical WS128K32-XG2LX - 8 grams typical WS128K32-XH1X - 13 grams typical WS128K32-XG4TX1 - 20 grams typical  Devices are upgradeable to 512Kx32 This product is subject to change without notice. FIGURE 1 – PIN CONFIGURATION FOR WS128K32N-XH1X Top View 1 12 23 34 45 56 I/O8 WE2# I/O15 I/O24 VCC I/O31 I/O9 CS2# I/O14 I/O25 CS4# I/O30 I/O10 GND I/O13 I/O26 WE4# I/O29 A13 I/O11 I/O12 A6 I/O27 I/O28 A14 A10 OE# A7 A3 A0 A15 A11 NC NC A4 A1 A16 A12 WE1# A8 A5 A2 NC VCC I/O7 A9 WE3# I/O23 I/O0 CS1# I/O6 I/O16 CS3# I/O22 I/O1 NC I/O5 I/O17 GND I/O21 I/O2 I/O3 I/O4 11 22 33 I/O18 I/O19 I/O20 44 55 66 Pin Description I/O0-31 A0-16 WE1-4# CS1-4# OE# VCC GND NC ...




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