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XC2VP70 Datasheet

Part Number XC2VP70
Manufacturers Xilinx
Logo Xilinx
Description Virtex-II Pro and Virtex-II Pro X Platform FPGAs
Datasheet XC2VP70 DatasheetXC2VP70 Datasheet (PDF)

Product Not Recommended For New Designs 1 R Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Complete Data Sheet DS083 (v5.0) June 21, 2011 0 Product Specification Module 1: Introduction and Overview 10 pages • Summary of Features • General Description • Architecture • IP Core and Reference Support • Device/Package Combinations and Maximum I/O • Ordering Information Module 2: Functional Description 60 pages • Functional Description: RocketIO™ X Multi-Gigabit Transceiver • Functional Descri.

  XC2VP70   XC2VP70






Part Number XC2VP70
Manufacturers Xilinx
Logo Xilinx
Description (XC2VPxxx) Platform Flash In-System Programmable Configuration PROMS
Datasheet XC2VP70 DatasheetXC2VP70 Datasheet (PDF)

www.DataSheet4U.com R Platform Flash In-System Programmable Configuration PROMS Product Specification DS123 (v2.9) May 09, 2006 0 Features • • • • • • • • • • In-System Programmable PROMs for Configuration of Xilinx FPGAs Low-Power Advanced CMOS NOR FLASH Process Endurance of 20,000 Program/Erase Cycles Operation over Full Industrial Temperature Range (–40°C to +85°C) IEEE Standard 1149.1/1532 Boundary-Scan (JTAG) Support for Programming, Prototyping, and Testing JTAG Command Initi.

  XC2VP70   XC2VP70







Virtex-II Pro and Virtex-II Pro X Platform FPGAs

Product Not Recommended For New Designs 1 R Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Complete Data Sheet DS083 (v5.0) June 21, 2011 0 Product Specification Module 1: Introduction and Overview 10 pages • Summary of Features • General Description • Architecture • IP Core and Reference Support • Device/Package Combinations and Maximum I/O • Ordering Information Module 2: Functional Description 60 pages • Functional Description: RocketIO™ X Multi-Gigabit Transceiver • Functional Description: RocketIO Multi-Gigabit Transceiver • Functional Description: Processor Block • Functional Description: PowerPC™ 405 Core • Functional Description: FPGA - Input/Output Blocks (IOBs) - Digitally Controlled Impedance (DCI) - On-Chip Differential Termination - Configurable Logic Blocks (CLBs) - 3-State Buffers - CLB/Slice Configurations - 18-Kb Block SelectRAM™ Resources - 18-Bit x 18-Bit Multipliers - Global Clock Multiplexer Buffers - Digital Clock Manager (DCM) • Routing • Configuration Module 3: DC and Switching Characteristics 59 pages • Electrical Characteristics • Performance Characteristics • Switching Characteristics • Pin-to-Pin Output Parameter Guidelines • Pin-to-Pin Input Parameter Guidelines • DCM Timing Parameters • Source-Synchronous Switching Characteristics Module 4: Pinout Information 302 pages • Pin Definitions • Pinout Tables - FG256/FGG256 Wire-Bond Fine-Pitch BGA Package - FG456/FGG456 Wire-Bond Fine-Pitch BGA Package - FG676/FGG676 Wire-Bond Fine-Pitch BGA P.


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