Photocouplers. TLP2451A Datasheet

TLP2451A Photocouplers. Datasheet pdf. Equivalent

Part TLP2451A
Description Photocouplers
Feature Photocouplers GaAℓAs Infrared LED & Photo IC TLP2451A TLP2451A 1. Applications • Industrial Invert.
Manufacture Toshiba
Datasheet
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Photocouplers GaAℓAs Infrared LED & Photo IC TLP2451A TLP24 TLP2451A Datasheet
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TLP2451A
Photocouplers GaAℓAs Infrared LED & Photo IC
TLP2451A
TLP2451A
1. Applications
• Industrial Inverters
• MOSFET Gate Drivers
• IGBT Gate Drivers
• Induction Cooktop and Home Appliances
2. General
The TLP2451A is a photocoupler in a SO8 package that consists of a GaAℓAs infrared light-emitting diode (LED)
optically coupled to an integrated high-gain, high-speed photodetector IC chip. It provides guaranteed performance
and specifications at temperatures up to 125. The TLP2451A has an internal Faraday shield that provides a
guaranteed Common-mode transient immunity of ±20 kV/µs. It has a totem-pole output that can both sink and
source current. The TLP2451A is ideal for IBGT and power MOSFET gate drive.
3. Features
(1) Output peak current: ±0.6 A (max)
(2) Operating temperature: -40 to 125
(3) Supply current: 2 mA (max)
(4) Supply voltage: 10 to 30 V
(5) Threshold input current: 5 mA (max)
(6) Propagation delay time: 500 ns (max)
(7) Common-mode transient immunity: ±20 kV/µs (min)
(8) Isolation voltage: 3750 Vrms (min)
(9) Safety standards
UL-approved: UL1577, File No.E67349
cUL-approved: CSA Component Acceptance Service No.5A File No.E67349
VDE-approved: EN60747-5-5 (Note 1)
Note 1: When an EN60747-5-5 approved type is needed, please designate the Option (V4).
©2016 Toshiba Corporation
1
Start of commercial production
2011-09
2016-02-10
Rev.2.0



TLP2451A
4. Packaging and Pin Configuration
11-5K1S
5. Internal Circuit (Note)
TLP2451A
1: N.C
2: Anode
3: Cathode
4: N.C
5: GND
6: Output
7: N.C
8: VCC
Note: A 0.1µF bypass capacitor must be connected between pin 8 and pin 5.
6. Principle of Operation
6.1. Truth Table
Input
H
L
LED
ON
OFF
M1
ON
OFF
M2
OFF
ON
Output
H
L
6.2. Mechanical Parameters
Characteristics
Creepage distances
Clearance distances
Internal isolation thickness
Min Unit
4.2 mm
4.2
©2016 Toshiba Corporation
2
2016-02-10
Rev.2.0





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