Document
CYStech Electronics Corp.
Spec. No. : C777LG Issued Date : 2011.08.16 Revised Date : Page No. : 1/3
Schottky Barrier Rectifiers Reverse Voltage 70V to 100V Forward Current 2.0 Amperes
SB270 thru SB2B0
Features
• Metal semiconductor junction with guard ring • Epitaxial construction • Low forward voltage drop • High current capability • The plastic material carries UL recognition 94V-0 • For use in low voltage, high frequency inverters, free wheeling,
and polarity protection applications
Mechanical Characteristics:
•Case: JEDEC DO-204AC(DO-15) molded plastic •Terminals: Tin plated axial leads, solderable per MIL-STD-750, method 2026 •Polarity: Color band denotes cathode •Mounting position: Any •Weight : 0.014oz., 0.39grams
Maximum Ratings and Electrical Characteristics
(Rating at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%)
Parameter
Symbol
SB270
Type SB280 SB290
SB2B0
Units
Maximum repetitive peak reverse voltage
VRRM 70 80 90 100 V
Maximum RMS voltage
VRMS 49 56 81 70 V
Maximum DC blocking voltage Maximum forward voltage at 2A
TJ=25°C TJ=100°C
VDC 70 VF
80 90 100 V 0.79 V 0.69
Maximum average forward rectified current @ TL=100°C IF(AV)
2
A
Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method)
IFSM
60
A
Maximum DC reverse current at rated DC blocking voltage
TJ=25°C TJ=100°C
IR
0.5 mA
10
Typical thermal resistance (Note 1)
RθJA
20 °C/W
Typical junction capacitance (Note 2) Operating junction temperature range Storage temperature range
CJ TJ TSTG
50 -55 ~ +125 -55 ~ +150
pF °C °C
Note: 1.Thermal resistance, junction to ambient. 2.Measured at1.0MHz and applied reverse voltage of 4.0VDC
SB270 thru SB2B0
CYStek Product Specification
CYStech Electronics Corp.
Ratings and Characteristic Curves
Spec. No. : C777LG Issued Date : 2011.08.16 Revised Date : Page No. : 2/3
SB270 thru SB2B0
CYStek Product Specification
CYStech Electronics Corp.
DO-204AC(DO-15) Dimension
Spec. No. : C777LG Issued Date : 2011.08.16 Revised Date : Page No. : 3/3
A B
CD
E
DIM
Inches Min. Max.
Millimeters Min. Max.
A φ0.028 φ0.034 φ0.70 φ0.90
B 1.000 - 25.40 -
C 0.2300 0.3000 5.80 7.60
*:Typical
DIM
Inches Min. Max.
Millimeters Min. Max.
D 1.000 - 25.40 -
E φ0.104 φ0.140 φ2.60 φ3.60
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SB270 thru SB2B0
CYStek Product Specification
.