Silicon P-Channel MOS FET
RQJ0601DGDQS
Silicon P Channel MOS FET Power Switching
Features
• Low on-resistance RDS(on) = 124 mΩ typ (VGS = –10 V, I...
Description
RQJ0601DGDQS
Silicon P Channel MOS FET Power Switching
Features
Low on-resistance RDS(on) = 124 mΩ typ (VGS = –10 V, ID = –1.4 A)
Low drive current High speed switching 4.5 V gate drive
Outline
RENESAS package code: PLZZ0004CA-A (Package name: UPAK R )
1 2 3
4
Note: Marking is “DG”.
REJ03G1266-0300 Rev.3.00
Jun 05, 2006
2, 4 D
1. Gate 1 G 2. Drain
3. Source 4. Drain S 3
*UPAK is a trademark of Renesas Technology Corp.
Absolute Maximum Ratings
Item
Symbol
Drain to source voltage
VDSS
Gate to source voltage
VGSS
Drain current Drain peak current
ID
ID
Note1 (pulse)
Body - drain diode reverse drain current Channel dissipation Channel dissipation
IDR
Pch Note2
Pch
Note1 (pulse)
Channel temperature
Tch
Storage temperature
Tstg
Notes: 1. PW ≤ 1 s, duty cycle ≤ 1%
2. When using the glass epoxy board (FR-4: 40 x 40 x 1 mm)
Ratings –60
+10 / –20 –2.8 –4.2 –2.8 1.5 5 150
–55 to +150
(Ta = 25°C)
Unit V V A A A W W °C °C
Rev.3.00 Jun 05, 2006 page 1 of 6
RQJ0601DGDQS
Electrical Characteristics
(Ta = 25°C)
Item
Symbol Min Typ Max Unit
Test conditions
Drain to source breakdown voltage V(BR)DSS –60
—
—
V ID = –10 mA, VGS = 0
Gate to source breakdown voltage V(BR)GSS +10
—
—
V IG = +100 µA, VDS = 0
Gate to source breakdown voltage V(BR)GSS –20
—
—
V IG = –100 µA, VDS = 0
Gate to source leak current
IGSS — — +10 µA VGS = +8 V, VDS = 0
Gate to source leak current
IGSS — — –10 µA VGS = –16 V, VDS = 0
Drain to source leak current
IDSS — — ...
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