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RS1MFH Dataheets PDF



Part Number RS1MFH
Manufacturers Kexin
Logo Kexin
Description Fast Recovery diodes
Datasheet RS1MFH DatasheetRS1MFH Datasheet (PDF)

SMD Type Fast Recovery diodes RS1AFH ~ RS1MFH Diodes ■ Features ● Low leakage current ● Excellent stability ● Guaranteed avalanche energy absorption capability ● Glass passivated ● High maximum operating temperature 12 PIN DESCRIPTION 1 Cathode 2 Anode Weight:17.6mg,0.00062 o z Simplified outline SOD-123FH ■ Absolute Maximum Ratings Ta = 25℃ Parameter Symbol RS1A RS1B RS1D RS1G RS1J FH FH FH FH F H RS1K RS1M FH FH Unit Repetitive Peak Reverse Voltage Surge Peak Reverse Voltage Maximum.

  RS1MFH   RS1MFH


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SMD Type Fast Recovery diodes RS1AFH ~ RS1MFH Diodes ■ Features ● Low leakage current ● Excellent stability ● Guaranteed avalanche energy absorption capability ● Glass passivated ● High maximum operating temperature 12 PIN DESCRIPTION 1 Cathode 2 Anode Weight:17.6mg,0.00062 o z Simplified outline SOD-123FH ■ Absolute Maximum Ratings Ta = 25℃ Parameter Symbol RS1A RS1B RS1D RS1G RS1J FH FH FH FH F H RS1K RS1M FH FH Unit Repetitive Peak Reverse Voltage Surge Peak Reverse Voltage Maximum DC Blocking Voltage Averaged Forward Current.TT=110℃ Peak Forward Surge Current Tj=25℃,VR=VRRMMax VRRM 50 100 200 400 600 800 1000 VRSM 35 70 140 280 420 560 700 V VR 50 100 200 400 600 800 1000 IFAV 1 A IFSM 25 Thermal Resistance From Junction to Ambient (Note.1) Rthj-a (Note.2) 100 150 K/W Thermal Resistance Junction to Tie-Point Rthj-tp 27 Junction Temperature Storage Temperature Tj Tstg 150 -50 to 150 ℃ Note.1 Device mounted on Al 2O3 printed-circuit board, 0.7 mm thick; thickness of copper ≥ 35 mm. Note.2 Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥ 40 mm. For more information please refer to the ‘General Part of associated Handbook’. ■ Electrical Characteristics Ta = 25℃ Parameter Forward Votalge Maximum DC Reverse Current Reverse Recovery Time Diode Capacitance Symbol Test Conditions Min Typ Max Unit VF IF=1A 1.3 V VR=VRRMMax IR VR=VRRMMax ,T J =125℃ 5 uA 50 IF = 0.5 A , IR = 1A, RS1A to RS1J trr IF = 0.5 A,IR=0.25A, RS1K and RS1M 250 ns 300 Cd VR=4V, f=1MHz 7 pF www.kexin.com.cn 1 SMD Type ■ Typical Characterisitics Fast Recovery diodes RS1AFH ~ RS1MFH Diodes handbook, h2alfpage IF(AV) (A) 1.5 1 0.5 0 0 40 80 VR = VRRMmax; δ = 0.5; a = 1.57. 120 160 200 Ttp (°C) Fig.2 Maximum permissible average forward current as a function of tie-point temperature (including losses due to reverse leakage). 102 handbook, halfpage IF (A) 10 1 10−1 10−2 10−3 0 123 VF (V) Tj = 25 ° C. Fig.4 Forward current as a function of forward voltage; typical values. handboo2k,0h0alfpage Tj (°C) 160 120 80 DG 40 JK M 0 0 400 800 VR (V) 1200 Fig.3 Maximum permissible junction temperature as a function of reverse voltage. 102 handbooIRk, halfpage (µA) 10 Tj = 125 °C 1 10−1 10−2 Tj = 25 °C 10−3 0 20 40 60 80 100 VR (%VRmax) Fig.5 Reverse current as a function of reverse voltage; typical values. 2 www.kexin.com.cn SMD Type ■ Typical Characterisitics 102 handbook, halfpage Fast Recovery diodes RS1AFH ~ RS1MFH 102 handbook, halfpage Cd Zth j-tp (pF) (K/W) 10 10 Diodes 1 10−2 10−1 f = 1 MHz; Tj = 25 °C. 1 10 102 VR (V) Fig.6 Diode capacitance as a function of reverse voltage; typical values. 1 1 10 102 103 tp (ms) 104 Fig.7 Transient thermal impedance as a function of pulse width. www.kexin.com.cn 3 SMD Type Fast Recovery diodes RS1AFH ~ RS1MFH ■ Typical Application Plastic surface mounted package; 2 leads ∠A LL R O U N D Diodes C E A e HE V M A D A e E pad pad bottom d UNIT ACD d E max 1.08 0.16 2.9 3.3 1.8 mm min 0.95 0.14 2.6 3.0 1.5 max 42.5 6.3 mil . min 37.4 5.5 114 130 102 118 70 60 e HE 1.0 3.8 0.7 3.5 39 150 28 138 ∠ 5° 1.1 (43) 2.0 (79) 1.1 (43) 1.8 (71) 1.1 (43) 0.8 (32) 0.8 (32) Uni t: mm (mil) 4 www.kexin.com.cn .


RS1KFH RS1MFH RS1A


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