Document
IS2008/10/13/15 SoC
Bluetooth® 4.1 Mono Audio SOC
Features
System Specification Compliant with Bluetooth Specification v.4.1
(EDR) in 2.4 GHz ISM band It supports following profiles :
- HFP 1.6 - HSP 1.1 - A2DP 1.2 - AVRCP 1.5 - SPP 1.0 - PBAP 1.0
Baseband Hardware 16MHz main clock input Built-in internal ROM for program memory Support to connect to two hosts ( phones,
tablets…) with HFP or A2DP profiles simultaneously Adaptive Frequency Hopping (AFH) avoids occupied RF channels Fast Connection supported
RF Hardware Fully Bluetooth 4.1 (EDR) system in 2.4
GHz ISM band. Combined TX/RX RF terminal simplifies
external matching and reduces external antenna switches. Max. +4dBm output power with 20 dB level control from register control. Built-in T/R switch for Class 2/3 application To avoid temperature variation, temperature sensor with temperature calibration is utilized into bias current and gain control. Fully integrated synthesizer has been created. There requires no external VCO, varactor diode, resonator and loop filter. Crystal oscillation with built-in digital trimming for temperature/process variations.
Audio processor
Support 64 kb/s A-Law or -Law PCM format, or CVSD (Continuous Variable Slope Delta Modulation) for SCO channel
operation. Noise suppression Echo suppression SBC and optional AAC decoding Packet loss concealment Build-in four languages (Chinese/ English/
Spanish/ French) voice prompts and 20 events for each one. (This function can be set up in “IS20XXS_UI” tool.) Support SCMS-T
Audio Codec 20 bit DAC and 16 bit ADC codec 98dB SNR DAC playback Built-in 1 channel 2.3W class-D amplifier for a
4Ω speaker (for IS2013/15S only)
Peripherals Built-in Lithium-ion battery charger (up to
350mA) Integrate 3V, 1.8V configurable switching
regulator and LDO Built-in ADC for battery monitor and voltage
sense. A line-in port for external audio input Two LED drivers
Flexible HCI interface High speed HCI-UART (Universal
Asynchronous Receiver Transmitter) interface (up to 921600bps)
Package 6x6mm2 48QFN package
(IS2008S, IS2010S) 7x7mm2 56QFN package (IS2013S, IS2015S)
Description
Mono Audio Chip is a compact, highly integrated, CMOS single-chip RF and baseband IC for Bluetooth v4.1 with Enhanced Data Rate 2.4GHz applications. This chip is fully compliant with Bluetooth specification and completely
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backward-compatible with Bluetooth 3.0, 2.0 or 1.2 systems.
It incorporates Bluetooth 1M/2M/3Mbps RF, single-cycle 8bit MCU, TX/RX modem, 5-port memory controller, task/hopping controller, UART interface, and MICROCHIP’s own Bluetooth software stack to achieve the required BT v4.1 with EDR functions.
To provide the superior audio and voice quality, it also integrates a DSP co-processor, a PLL, and a CODEC dedicated for voice and audio applications.
For voice, not only basic CVSD encoding and decoding but also enhanced noise reduction and echo cancellation are implemented by the built-in DSP to achieve better quality in both sending and receiving sides. For the enhanced
Mono Audio SoC
audio applications, SBC/AAC_LC decoding functions can be also carried out by DSP to satisfy Bluetooth A2DP requirements.
In addition, to minimize the external components required for portable devices, a battery voltage sensor, battery charger, a switching regulator and LDO are integrated to reduce system BOM cost for various Bluetooth applications.
As the market of portable/wireless speakers demand is increasing, a 1 channels 2.3W class-D amplifier which provides up to 100dB SNR is also built-in to reduce BOM cost and PCB area.
Applications
Mono headsets with A2DP Mono speakerphones
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Mono Audio SoC
Table of Contents 1.0 DEVICE OVERVIEW ....................................................................................................................................4 2.0 KEY FEATURES TABLE ..............................................................................................................................5 3.0 PIN DESCRIPTION AND POWER SUPPLY................................................................................................6 4.0 TRANSCEIVER...........................................................................................................................................13 5.0 MICROPROCESSOR .................................................................................................................................14 6.0 AUDIO .........................................................................................................................................................15 7.0 POWER MANAGEMENT UNIT ..................................................................................................................17 8.0 GENERAL PURPOSE IOs..........................................................................................................................19 9.0 OPERATION WITH EXTERNAL MCU ...................