SSF7508

Main Product Characteristics: VDSS RDS(on) 75V 6mΩ (typ.) ID 100A TO-220 Features and Benefits:  Advanced MOSFET process technology  Special designed for PWM, load switching and general purpose applications  Ultra low on-resistance with low gate charge  Fast switching and reverse body recovery  175℃ operating temperature SSF7508 Marking and pin Schematic diagram Assignment Description: It utilizes the latest processing techniques to achieve the high cell density and reduces the on-resistance with high repetitive avalanche rating. These features combine to make this design an extremely efficient and reliable device for use in power switching application and a wide variety of other applications. Absolute max Rating: Symbol ID @ TC = 25°C ID @ TC = 100°C IDM PD @TC = 25°C VDS VGS EAS IAS TJ TSTG Parameter Continuous Drain Current, VGS @ 10V ① Continuous Drain Current, VGS @ 10V ① Pulsed Drain Current ② Power Dissipation ③ Linear Derating Factor Drain-Source Voltage Gate-to-Source Voltage Single Pulse Avalanche Energy @ L=0.3mH ② Avalanche Current @ L=0.3mH ② Operating Junction and Storage Temperature Range Max. 100 70 400 200 1.3 75 ± 20 205 37 -55 to + 175 Units A W W/°C V V mJ A °C ©Silikron Semiconductor CO.,LTD. 2013.03.19 www.silikron.com Version : 2.3 page 1 of 8 SSF7508 Thermal Resistance Symbol RθJC RθJA Characterizes Junction-to-case③ Junction-to-ambient (t ≤ 10s) ④ Junction-to-Ambient (PCB mounted, steady-state) ④ Typ. — — — Max. 0.75 62 40 ...