2 Meg x 18 x 16 Banks RLDRAM
RLDRAM 3
IS49RL18320– 2 Meg x 18 x 16 Banks IS49RL36160– 1 Meg x 36 x 16 Banks
Features
• 1066 MHz DDR operation (2133...
Description
RLDRAM 3
IS49RL18320– 2 Meg x 18 x 16 Banks IS49RL36160– 1 Meg x 36 x 16 Banks
Features
1066 MHz DDR operation (2133 Mb/s/ball data
rate)
76.8 Gb/s peak bandwidth (x36 at 1066 MHz clock
frequency)
Organization
– 32 Meg x 18, and 16 Meg x 36 common I/O (CIO)
– 16 banks
1.2V center-terminated push/pull I/O
2.5V V EXT , 1.35V V DD , 1.2V V DDQ I/O Reduced cycle time (tRC (MIN) = 8 - 12ns)
SDR addressing
Programmable READ/WRITE latency (RL/WL) and
burst length
Data mask for WRITE commands
Fr
x,
DK x#) and output data clocks (QK x, QK x#)
On-die DLL generates CK edge-aligned data and
64ms refresh (128K refresh per 64ms) 168-ball FBGA package Ω or 60 Ω matched impedance outputs Integrated on-die termination (ODT) Single or multibank writes Extended operating range (200–1066 MHz) READ training register Multiplexed and non-multiplexed addressing capa-
bilities Mirror function Output driver and ODT calibration JTAG interface (IEEE 1149.1-2001)
576Mb: x18, x36 RLDRAM 3 Features
Options
Clock cycle and tRC timing
– 0.93ns and tRC (MIN) = 8ns
(RL3-2133)
– 0.93ns and tRC (MIN) = 10ns
(RL3-2133)
– 1.07ns and tRC (MIN) = 8ns
(RL3-1866)
– 1.07ns and tRC (MIN) = 10ns
(RL3-1866)
– 1.25ns and tRC (MIN) = 8ns
(RL3-1600)
– 1.25ns and tRC (MIN) = 10ns
(RL3-1600)
– 1.25ns and tRC (MIN) = 12ns
(RL3-1600)
Con guration
-32 Meg x 18
- 16 Meg x 36
Operating Temperature
– Commercial (TC = 0° to +95°C)
– Industr...
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