LNA Module. ALN0071WT Datasheet

ALN0071WT Module. Datasheet pdf. Equivalent

ALN0071WT Datasheet
Recommendation ALN0071WT Datasheet
Part ALN0071WT
Description Internally Matched LNA Module
Feature ALN0071WT; plerowTM ALN0071WT Internally Matched LNA Module C o u pl er C o u pl er Features · S21 = 22.1 dB@.
Manufacture ASB
Datasheet
Download ALN0071WT Datasheet




ASB ALN0071WT
plerowTM ALN0071WT
Internally Matched LNA Module
Features
· S21 = 22.1 dB@65 MHz
= 21.9 dB@75 MHz
· NF of 0.9 dB over Frequency
· Unconditionally Stable
· Single 5 V Supply
· High OIP3 at Low Current
Description
The plerowTM ALN-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-
cation terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
Specifications (in Production)
Typ.@T = 25 C, Vs = 5 V, Freq. = 70 MHz, Zo.sys = 50 ohms
Parameter
Specifications
Unit
Min Typ Max
Frequency Range
MHz
65
75
Gain
dB 21 22
Gain Flatness
dB
0.1
0.2
Noise Figure
dB
0.9 0.95
Output IP3 (1)
dBm 29 30
S11/S22 (2)
dB
-18/-10
Output P1dB
dBm 20 21
Switching Time (3)
sec
Supply Current
mA
60 80
Supply Voltage
V
5
Impedance
50
Max. RF Input Power
dBm
C.W 23~25 (before fail)
Package Type & Size
mm Surface Mount Type, 10Wx10Lx3.8H
Operating temperature is -40 C to +85 C.
1) OIP3 is measured with two tones at an output power of 4 dBm/tone separated by 1 MHz.
2) S11, S22(max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
1-stage Single Type
More Information
Website: www.asb.co.kr
E-mail: sales@asb.co.kr
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
Outline Drawing (Unit: mm)
plerow
ALN0071WT
ASB Inc.
(Top View)
Solder Stencil Area
(Bottom View)
(Side View)
Pin Number
2
5
6
Others
Function
RF In
RF Out
Vs
Ground
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
Ø 0.4 plated thru holes to ground plane
1/3
(Recommended Footprint)
www.asb.co.kr
September 2014



ASB ALN0071WT
Typical Performance
(Measured)
65~75 MHz
+5 V
S-parameters & K Factor
30 7
20 S21
10
6
5
04
-10 S22
3
-20 S11
-30
S12
K
2
1
-40
0
1000
2000 3000 4000
Frequency (MHz)
5000
0
6000
OIP3
plerowTM ALN0071WT
Internally Matched LNA Module
30
20
10
0
-10
-20
-30
-40
65
S-parameters
S21
S22
S11
S12
K
67 69 71 73
Frequency (MHz)
7
6
5
4
3
2
1
0
75
Noise Figure
P1dB
2/3
www.asb.co.kr
September 2014



ASB ALN0071WT
Application Circuit
C1
IN
plerowTM ALN0071WT
Internally Matched LNA Module
VS
+-
Tantal or MLC (Multi Layer Ceramic)
Capacitor
C2
ALN
OUT
1) The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced
from the DC supply. The capacitance value may be determined by customers DC supply status. The ca-
pacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for
the best electrical performance.
2) DC blocking capacitors are always necessarily placed at the input and output port for allowing only the
RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are includ-
ed inside the ALN module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just
in case that the customer wants. The value of C1 & C2 is determined by considering the application fre-
quency.
Recommended Soldering Reflow Process
260 C
20~40 sec
Evaluation Board Layout
Vs
Ramp-up
(3 C/sec)
200 C
Ramp-down
(6 C/sec)
IN
OUT
150 C
60~180 sec
Size 25x25 mm
(for ALN-AT, BT, WT, T Series 10x10 mm)
3/3
www.asb.co.kr
September 2014







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