LNA Module. ALN1300 Datasheet

ALN1300 Module. Datasheet pdf. Equivalent

ALN1300 Datasheet
Recommendation ALN1300 Datasheet
Part ALN1300
Description Internally Matched LNA Module
Feature ALN1300; plerowTM ALN1300 Internally Matched LNA Module C o u pl er C o u pl er Features · S21 = 40.0 dB@12.
Manufacture ASB
Datasheet
Download ALN1300 Datasheet




ASB ALN1300
plerowTM ALN1300
Internally Matched LNA Module
Features
· S21 = 40.0 dB@1200 MHz
= 39.0 dB@1400 MHz
· NF of 0.7 dB over Frequency
· Unconditionally Stable
· Single 5 V Supply
· High OIP3@Low Current
Description
The plerowTM ALN-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-
cation terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
Specifications (in Production)
Typ.@T = 25 C, Vs = 5 V, Freq. = 1300 MHz, Zo.sys = 50 ohms
Parameter
Specifications
Unit
Min Typ Max
Frequency Range
MHz
1200
1400
Gain
dB 38.5 39.5
Gain Flatness
dB
0.5 0.6
Noise Figure
dB
0.7 0.75
Output IP3
dBm 35 36
S11/S22
dB
-15/-15
Output P1dB
dBm 19 20
Switching Time (3)
sec
-
Supply Current
mA
160 180
Supply Voltage
V
5
Impedance
50
Max. RF Input Power
dBm
C.W 23~25 (before fail)
Package Type & Size
mm Surface Mount Type, 13Wx13Lx3.8H
Operating temperature is -40C to +85C.
1) OIP3 is measured with two tones at an output power of +4 dBm/tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
Outline Drawing (Unit: mm)
2-stage Single Type
More Information
Website: www.asb.co.kr
E-mail: sales@asb.co.kr
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
plerow
ALN1300
ASB Inc.
(Top View)
Solder Stencil Area
(Side View)
(Bottom View)
Pin Number
3
8
10
Others
Function
RF In
RF Out
Vs
Ground
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
Ø 0.4 plated thru holes to ground plane
1/3
(Recommended Footprint)
www.asb.co.kr
October 2014



ASB ALN1300
Typical Performance
(Measured)
1200~1400
+5 V
50
40
30
20
10
0
-10
-20
-30
-40
-50
0
S-parameters & K Factor
S21
S11
S22
S12
K
1000 2000 3000 4000
Frequency (MHz)
5000
10
9
8
7
6
5
4
3
2
1
0
6000
plerowTM ALN1300
Internally Matched LNA Module
50
40
30
20
10
0
-10
-20
-30
-40
-50
-60
1200
S-parameters
S21
S11
S22
K
S12
1250
1300
1350
Frequency (MHz)
11
10
9
8
7
6
5
4
3
2
1
0
1400
Noise Figure
OIP3
P1dB
2/3
www.asb.co.kr
October 2014



ASB ALN1300
Application Circuit
C1
IN
plerowTM ALN1300
Internally Matched LNA Module
VS
+-
Tantal or MLC (Multi Layer Ceramic)
Capacitor
C2
ALN
OUT
1) The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced
from the DC supply. The capacitance value may be determined by customers DC supply status. The ca-
pacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for
the best electrical performance.
2) DC blocking capacitors are always necessarily placed at the input and output port for allowing only the
RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are includ-
ed inside the ALN module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just
in case that the customer wants. The value of C1 & C2 is determined by considering the application fre-
quency.
Recommended Soldering Reflow Process
260 C
Ramp-up
(6 C/sec)
200 C
20~40 sec
Ramp-down
(6 C/sec)
Evaluation Board Layout
Vs
IN OUT
150 C
60~180 sec
Size 25x25mm
(for ALN Series 13x13mm)
3/3
www.asb.co.kr
October 2014







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