LNA Module. ALN2150AT Datasheet

ALN2150AT Module. Datasheet pdf. Equivalent

ALN2150AT Datasheet
Recommendation ALN2150AT Datasheet
Part ALN2150AT
Description Internally Matched LNA Module
Feature ALN2150AT; plerowTM ALN2150AT Internally Matched LNA Module Features · S21 = 14.5 dB@2000 MHz = 13.5 dB@2300 M.
Manufacture ASB
Datasheet
Download ALN2150AT Datasheet




ASB ALN2150AT
plerowTM ALN2150AT
Internally Matched LNA Module
Features
· S21 = 14.5 dB@2000 MHz
= 13.5 dB@2300 MHz
· NF of 0.6 dB over Frequency
· Unconditionally Stable
· Single 5 V Supply
· High OIP3@Low Current
Description
The plerowTM ALN-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-
cation terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
Specifications (in Production)
Typ.@T = 25 C, Vs = 5 V, Freq. = 2150 MHz, Zo.sys = 50 ohms
Parameter
Specifications
Unit
Min Typ Max
Frequency Range
MHz
2000
2300
Gain
dB 13 14
Gain Flatness
dB
0.5 0.6
Noise Figure
dB
0.6 0.65
Output IP3 (1)
dBm 31 32
S11 / S22 (2)
dB
-18 / -9
Output P1dB
dBm 18 19
Switching Time (3)
sec
Supply Current
mA
65 75
Supply Voltage
V
5
Impedance
50
Max. RF Input Power
Package Type & Size
dBm
mm
C.W 29~31 (before fail)
Surface Mount Type, 10Wx10Lx3.8H
Operating temperature is -40 C to +85 C.
1) OIP3 is measured with two tones at an output power of +5 dBm/tone separated by 1 MHz.
2) S11, S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
1-stage Single Type
More Information
Website: www.asb.co.kr
E-mail: sales@asb.co.kr
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
ASB Inc., 4th Fl. Venture Town
Bldg., 367-17 Goijeong-Dong,
Seo-Gu, Daejon 302-716, Korea
Outline Drawing (Unit: mm)
plerow
ALN2150AT
ASB Inc.
(Top View)
Solder Stencil Area
(Bottom View)
(Side View)
Pin Number
2
5
6
Others
Function
RF In
RF Out
Vs
Ground
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
Ø 0.4 plated thru holes to ground plane
1/3
(Recommended Footprint)
www.asb.co.kr
July 2011



ASB ALN2150AT
Typical Performance
(Measured)
2000~2300
+5 V
S-parameters & K Factor
plerowTM ALN2150AT
Internally Matched LNA Module
S-parameters
Noise Figure
OIP3
P1dB
2/3
www.asb.co.kr
July 2011



ASB ALN2150AT
Application Circuit
C1
IN
plerowTM ALN2150AT
Internally Matched LNA Module
VS
+-
Tantal or MLC (Multi Layer Ceramic)
Capacitor
C2
ALN
OUT
1) The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced
from the DC supply. The capacitance value may be determined by customers DC supply status. The ca-
pacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for
the best electrical performance.
2) DC blocking capacitors are always necessarily placed at the input and output port for allowing only the
RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are includ-
ed inside the ALN module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just
in case that the customer wants. The value of C1 & C2 is determined by considering the application fre-
quency.
Recommended Soldering Reflow Process
260C
20~40 sec
Evaluation Board Layout
Vs
Ramp-up
(3˚C/sec)
200C
Ramp-down
(6C/sec)
IN
OUT
150C
60~180 sec
Size 25x25mm
(for ALN-AT, BT, T Series 10x10mm)
3/3
www.asb.co.kr
July 2011





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