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IS67WVE2M16ALL Dataheets PDF



Part Number IS67WVE2M16ALL
Manufacturers ISSI
Logo ISSI
Description 1.8V Core Async/Page PSRAM
Datasheet IS67WVE2M16ALL DatasheetIS67WVE2M16ALL Datasheet (PDF)

IS66WVE2M16ALL IS67WVE2M16ALL 1.8V Core Async/Page PSRAM Overview The IS66WVE2M16ALL is an integrated memory device containing 32Mbit Pseudo Static Random Access Memory using a self-refresh DRAM array organized as 2M words by 16 bits. The device includes several power saving modes : Partial Array Refresh mode where data is retained in a portion of the array and Deep Power Down mode. Both these modes reduce standby current drain. The die has separate power rails, VDDQ and VSSQ for the I/O to be r.

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IS66WVE2M16ALL IS67WVE2M16ALL 1.8V Core Async/Page PSRAM Overview The IS66WVE2M16ALL is an integrated memory device containing 32Mbit Pseudo Static Random Access Memory using a self-refresh DRAM array organized as 2M words by 16 bits. The device includes several power saving modes : Partial Array Refresh mode where data is retained in a portion of the array and Deep Power Down mode. Both these modes reduce standby current drain. The die has separate power rails, VDDQ and VSSQ for the I/O to be run from a separate power supply from the device core. Features  Asynchronous and page mode interface  Dual voltage rails for optional performance  VDD 1.8V, VDDQ 1.8V  Page mode read access  Interpage Read access : 70ns  Intrapage Read access : 20ns  Low Power Consumption  Asynchronous Operation < 30 mA  Intrapage Read < 18mA  Standby < 180 uA (max.)  Deep power-down (DPD) < 3uA (Typ)  Low Power Feature  Temperature Controlled Refresh  Partial Array Refresh  Deep power-down (DPD) mode  Operating temperature Range Industrial and Automotive A1: -40°C~85°C  Package: 48-ball TFBGA, 48-pin TSOP-I Notes : 1. The 48-pin TSOP-I package option is not yet available. Please contact SRAM marketing at [email protected] for additional information. Copyright © 2011 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances Rev. B | Jan. 2012 www.issi.com - [email protected] 1 IS66WVE2M16ALL IS67WVE2M16ALL General Description PSRAM products are high-speed, CMOS pseudo-static random access memory developed for low-power, portable applications. The 32Mb DRAM core device is organized as 2 Meg x 16 bits. These devices include the industry-standard, asynchronous memory interface found on other low-power SRAM or pseudo-SRAM (PSRAM) offerings. For seamless operation on an asynchronous memory bus, PSRAM products incorporated a transparent self-refresh mechanism. The hidden refresh requires no additional support from the system memory controller and has no significant impact on device read/write performance. A user-accessible configuration registers (CR) defines how the PSRAM device performs onchip refresh and whether page mode read accesses are permitted. This register is automatically loaded with a default setting during power-up and can be updated at any time during normal operation. Special attention has been focused on current consumption during self-refresh. This product includes two system-accessible mechanisms to minimize refresh current. Setting sleep enable (ZZ#) to LOW enables one of two low-power modes: partial-array refresh (PAR) or deep power-down (DPD). PAR limits refresh to only that part of the DRAM array that contains essential data. DPD halts refresh operation altogether and is used when no vital information is stored in the device. The system-configurable refresh mechanisms are accessed through the CR. A0~A20 Address Decode Logic Configuration Register (CR) 2048K X 16 DRAM Memory Array Input /Output Mux And Buffers CE# WE# OE# LB# UB# ZZ# Control Logic Rev. B | Jan. 2012 [ Functional Block Diagram] www.issi.com - [email protected] DQ0~DQ15 2 IS66WVE2M16ALL IS67WVE2M16ALL 48Ball TFBGA Ball Assignment 1 23 456 A LB# OE# A0 A1 A2 ZZ# B DQ8 UB# A3 A4 CE# DQ0 C DQ9 DQ10 A5 A6 DQ1 DQ2 D VSSQ DQ11 A17 A7 DQ3 VDD E VDDQ DQ12 NC A16 DQ4 VSS F DQ14 DQ13 A14 A15 DQ5 DQ6 G DQ15 A19 A12 A13 WE# DQ7 H A18 A8 A9 A10 A11 A20 [Top View] (Ball Down) Rev. B | Jan. 2012 www.issi.com - [email protected] 3 48-pin TSOP-I (Top View) IS66WVE2M16ALL IS67WVE2M16ALL Notes : 1. The 48-pin TSOP-I package option is not yet available. Please contact SRAM marketing at [email protected] for additional information. Rev. B | Jan. 2012 www.issi.com - [email protected] 4 IS66WVE2M16ALL IS67WVE2M16ALL Signal Descriptions All signals for the device are listed below in Table 1. Table 1. Signal Descriptions Symbol VDD VDDQ VSS VSSQ DQ0~DQ15 A0~A20 LB# UB# CE# OE# WE# ZZ# Type Power Supply Powe.


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