Document
Features Low gate charge 100% avalanche tested Improved dv/dt capability RoHS compliant Halogen free package JEDEC Qualification Improved ESD performance
TMP2N60AZ(G)/TMPF2N60AZ(G)
BVDSS 600V
N-channel MOSFET
ID RDS(on)
2.0A
< 4.0W
Device TMP2N60AZ / TMPF2N60AZ TMP2N60AZG / TMPF2N60AZG
Package TO-220 / TO-220F TO-220 / TO-220F
Absolute Maximum Ratings
Parameter
Drain-Source Voltage
Gate-Source Voltage Continuous Drain Current Pulsed Drain Current (Note 1)
TC = 25 ℃ TC = 100 ℃
Single Pulse Avalanche Energy (Note 2)
Repetitive Avalanche Current (Note 1)
Repetitive Avalanche Energy (Note 1)
Power Dissipation
TC = 25 ℃ Derate above 25 ℃
Peak Diode Recovery dv/dt (Note 3)
Operating Junction and Storage Temperature Range
Maximum lead temperature for soldering purposes, 1/8” from case for 5 seconds
* Limited only by maximum junction temperature
Marking TMP2N60AZ / TMPF2N60AZ TMP2N60AZG / TMPF2N60AZG
Remark RoHS
Halogen Free
Symbol VDSS VGS
ID
IDM EAS IAR EAR
PD
dv/dt TJ, TSTG
TL
TMP2N60AZ(G) TMPF2N60AZ(G)
600 ±30 2.0 2.0 *
1.43 1.43 * 8 8*
66
2.0 5.21
52.1 17.3
0.416
0.138
4.5
-55~150
300
Unit V V A A A mJ A mJ W
W/℃ V/ns
℃
℃
Thermal Characteristics
Parameter Maximum Thermal resistance, Junction-to-Case Maximum Thermal resistance, Junction-to-Ambient
Symbol RqJC RqJA
TMP2N60AZ(G) 2.4 62.5
October 2012 : Rev0
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TMPF2N60AZ(G) 7.2 62.5
Unit ℃/W ℃/W
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TMP2N60AZ(G)/TMPF2N60AZ(G)
Electrical Characteristics : TC=25℃, unless otherwise noted
Parameter
Symbol
Test condition
Min Typ Max Units
OFF
Drain-Source Breakdown Voltage
BVDSS
VGS = 0 V, ID = 250 µA 600 --
--
V
Zero Gate Voltage Drain Current
VDS = 600 V, VGS = 0 V
--
IDSS
VDS = 480 V, TC = 125°C
--
-- 1 µA -- 10 µA
Forward Gate-Source Leakage Current
IGSSF
VGS = 30 V, VDS = 0 V
--
-- 100 µA
Reverse Gate-Source Leakage Current
IGSSR
VGS = -30 V, VDS = 0 V
--
--
-100
µA
ON Gate Threshold Voltage
Drain-Source On-Resistance Forward Transconductance (Note 4)
VGS(th)
VDS = VGS, ID = 250 µA
3
--
5
V
RDS(on)
VGS = 10 V, ID = 1.0 A
-- 3.2 4.0 W
gFS VDS = 30 V, ID = 1.0 A -- 3 -- S
DYNAMIC Input Capacitance Output Capacitance Reverse Transfer Capacitance
Ciss Coss Crss
VDS = 25 V, VGS = 0 V, f = 1.0 MHz
-- 360 --- 41 --- 7 --
pF pF pF
SWITCHING Turn-On Delay Time (Note 4,5) Turn-On Rise Time (Note 4,5) Turn-Off Delay Time (Note 4,5) Turn-Off Fall Time (Note 4,5) Total Gate Charge (Note 4,5) Gate-Source Charge (Note 4,5) Gate-Drain Charge (Note 4,5)
td(on)
VDD = 300 V, ID = 2.0 A,
--
20
--
ns
tr RG = 25 Ω, VGS = 10 V -- 23 -- ns
td(off)
-- 42 -- ns
tf -- 20 -- ns
Qg
VDS = 480 V, ID = 2.0 A,
--
9
-- nC
Qgs
VGS = 10 V
-- 2 -- nC
Qgd -- 4 -- nC
SOURCE DRAIN DIODE Maximum Continuous Drain-Source Diode Forward Current Maximum Pulsed Drain-Source Diode Forward Current
Drain-Source Diode Forward Voltage
Reverse Recovery Time (Note 4)
Reverse Recovery Charge (Note 4)
IS
ISM VSD trr Qrr
----
---VGS = 0 V, IS = 2.0 A VGS = 0 V, IS = 2.0 A dIF / dt = 100 A/µs
-- -- 2.0 A
-- -- 8 A
-- -- 1.5 V
-- 240 --
ns
-- 0.8 -- µC
Note :
1. Repeated rating : Pulse width limited by safe operating area 2. L=30.5mH, I AS = 2.0A, VDD = 50V, RG = 25Ω, Starting TJ= 25 ℃ 3 I SD ≤ 2.0A, di/dt ≤ 200A/µs , VDD ≤ BVDS, Starting TJ= 25 ℃ 4. Pulse Test :Pulse width ≤ 300µs, Duty Cycle ≤ 2%
5. Essentially Independent of Operating Temperature Typical Characteristics
October 2012 : Rev0
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Drain Current, I [A] D
TMP2N60AZ(G)/TMPF2N60AZ(G)
6
Top V =15.0V GS 10.0V 9.0V 8.0V 7.0V
4 6.0V Bottom 5.5V
2
1. T = 25℃ C
2. 250μs Pulse Test 0
0 5 10 15 20
Drain-Source Voltage, V [V] DS
6
T = 25℃ J
5
4
3
2 01
V = 10V GS
234
Drain Current,I [A] D
V = 20V GS
56
Reverse Drain Current, I [A] DR
Drain Current, I [A] D
10
V = 30V DS
250 μs Pulse Test
150℃
1 25℃
-55℃
0.1 2468
Gate-Source Voltage, V [V] GS
8
V = 0V GS
250μs Pulse Test
6
4 150℃
25℃
2
0 0.0 0.5 1.0 1.5
Source-Drain Voltage, V [V] SD
10 2.0
Drain-Source On-Resistance R [Ω]
DS(ON)
Capacitance [pF]
600 500
C = C + C (C = shorted) iss gs gd ds
C =C +C oss ds gd
C =C rss gd
12 I = 2.0A
D
10
V = 300V DS
C
V =0V GS
400
iss f = 1 MHz
8
V = 120V DS
Gate-Source Voltage, V [V] GS
300 C oss
200 C
rss
100
6 4 2
V = 480V DS
0 10-1 100 101
Drain-Source Voltage, V [V] DS
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Total Gate Charge, Q [nC] G
10 12
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TMP2N60AZ(G)/TMPF2N60AZ(G)
Drain-Source Breakdown Voltage BV , (Normalized)
DSS
1.20 1.15 1.10
V =0V GS
I = 250 μA
D
1.05
1.00
0.95
0.90
0.85
0.80 -80
-40
0 40 80
Junction Temperature,T [oC] J
120
160
Drain-Source On-Resistance R , (Normalized)
DS(ON)
3.0
V = 10 V GS
I = 1.0 A
D
2.5
2.0
1.5
1.0
0.5
0.0 -80
-40 0
40 80 120
Junction Temperature, T [oC]
J
160
Drain Current, I [A] D
2.0 1.5
1.5
1.0
0.5
0.0 25
Gate Threshold Voltage V , (Normalized)
TH
1.0
50 75 100 125
Case Temperature, T [℃] C
0.5
.