N-channel MOSFET
Features Low gate charge 100% avalanche tested Improved dv/dt capability RoHS compliant JEDEC Qualification
T...
Description
Features Low gate charge 100% avalanche tested Improved dv/dt capability RoHS compliant JEDEC Qualification
TMA7N90/TMAN7N90
VDSS = 990 V @Tjmax ID = 7.2A RDS(on) = 1.9 W(max) @ VGS= 10 V
TO-3P/TO3PN
D
G
Device TMA7N90/TMAN7N90
Package TO-3P
Marking TMA7N90/TMAN7N90
S Remark RoHS
Absolute Maximum Ratings
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current Pulsed Drain Current (Note 1)
TC = 25 ℃ TC = 100 ℃
Single Pulse Avalanche Energy (Note 2)
Repetitive Avalanche Current (Note 1)
Repetitive Avalanche Energy (Note 1)
Power Dissipation
TC = 25 ℃ Derate above 25 ℃
Peak Diode Recovery dv/dt (Note 3)
Operating Junction and Storage Temperature Range
Maximum lead temperature for soldering purposes, 1/8” from case for 5 seconds
* Limited only by maximum junction temperature
Symbol VDS VGS
ID
IDM EAS IAR EAR
PD
dv/dt TJ, TSTG
TL
TMA7N90/TMAN7N90 900 ±30 7.2 4.5 28.8 109 7.2 26.6 266 2.12 4.5
-55~150
300
Unit V V A A A mJ A mJ W
W/℃ V/ns
℃
℃
Thermal Characteristics
Parameter Maximum Thermal resistance, Junction to Case Typical Thermal resistance, Case to Sink(Typical) Maximum Thermal resistance, Junction to Ambient
Symbol RqJC RqCS RqJA
TMA7N90 0.47 0.24 40
Unit ℃/W ℃/W ℃/W
December 2011 : Rev1
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TMA7N90/TMAN7N90
Electrical Characteristics : TC=25℃, unless otherwise noted
Parameter
Symbol
Test condition
Min Typ Max Units
OFF
Drain-Source Breakdown Voltage
BVDSS
VGS = 0 V, ID = 250 µA 900 ...
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