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THGBM4G6D2HBAIR Datasheet, Equivalent, e-MMC Module.

8GB e-MMC Module

8GB e-MMC Module

 

 

 

Part THGBM4G6D2HBAIR
Description 8GB e-MMC Module
Feature Preliminary THGBM4G6D2HBAIR 8GB THGBM4G 6D2HBAIR TOSHIBA e-MMC Module INTRODU CTION THGBM4G6D2HBAIR is 8-GByte densi ty of e-MMC Module product housed in 15 3 ball BGA package.
This unit utilizes advanced TOSHIBA NAND flash devices and a controller chip assembled as Multi C hip Module.
THGBM4G6D2HBAIR has an indu stry standard MMC protocol for easy use .
FEATURES THGBM4G6D2HBAIR Interface T HGBM4G6D2HBAIR has the JEDEC/MMCA Versi on 4.
41 interface with either 1-I/O, 4- I/O and 8-I/O mode support.
Ball / Sign al Allocation P-VFBGA153-1113-0.
50-002F P(A) (11.
5 x 13mm, H1.
0mm max.
package) 14 NC NC NC .
Manufacture Toshiba
Datasheet
Download THGBM4G6D2HBAIR Datasheet
Part THGBM4G6D2HBAIR
Description 8GB e-MMC Module
Feature Preliminary THGBM4G6D2HBAIR 8GB THGBM4G 6D2HBAIR TOSHIBA e-MMC Module INTRODU CTION THGBM4G6D2HBAIR is 8-GByte densi ty of e-MMC Module product housed in 15 3 ball BGA package.
This unit utilizes advanced TOSHIBA NAND flash devices and a controller chip assembled as Multi C hip Module.
THGBM4G6D2HBAIR has an indu stry standard MMC protocol for easy use .
FEATURES THGBM4G6D2HBAIR Interface T HGBM4G6D2HBAIR has the JEDEC/MMCA Versi on 4.
41 interface with either 1-I/O, 4- I/O and 8-I/O mode support.
Ball / Sign al Allocation P-VFBGA153-1113-0.
50-002F P(A) (11.
5 x 13mm, H1.
0mm max.
package) 14 NC NC NC .
Manufacture Toshiba
Datasheet
Download THGBM4G6D2HBAIR Datasheet

THGBM4G6D2HBAIR

THGBM4G6D2HBAIR
THGBM4G6D2HBAIR

THGBM4G6D2HBAIR

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