Power MOSFET
VDS RDS(on) max
(@VGS = -10V)
Qg (typical) ID
(@TA = 25°C)
-150 2.4 6 -0.7
V Ω nC A
IRF6217PbF-1
HEXFET® Power MOSFE...
Description
VDS RDS(on) max
(@VGS = -10V)
Qg (typical) ID
(@TA = 25°C)
-150 2.4 6 -0.7
V Ω nC A
IRF6217PbF-1
HEXFET® Power MOSFET
S1 S2 S3 G4
8
A D
7D
6D
5D
Top View
SO-8
Features Industry-standard pinout SO-8 Package
Compatible with Existing Surface Mount Techniques RoHS Compliant, Halogen-Free
MSL1, Industrial qualification
Benefits ⇒ Multi-Vendor Compatibility
Easier Manufacturing Environmentally Friendlier
Increased Reliability
Base Part Number Package Type
IRF6217PbF-1
SO-8
Standard Pack
Form
Quantity
Tube/Bulk
95
Tape and Reel
4000
Orderable Part Number
IRF6217PbF-1 IRF6217TRPbF-1
Absolute Maximum Ratings
ID @ TA = 25°C ID @ TA = 70°C IDM PD @TA = 25°C
VGS dv/dt TJ TSTG
Parameter Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current Power Dissipation Linear Derating Factor Gate-to-Source Voltage
Peak Diode Recovery dv/dt Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds
Max. -0.7 -0.5 -5.0 2.5 0.02 ± 20 4.5 -55 to + 150
300 (1.6mm from case )
Units
A
W W/°C
V V/ns
°C
Thermal Resistance
Symbol
RθJL RθJA
Parameter Junction-to-Drain Lead Junction-to-Ambient
Typ. ––– –––
Max. 20 50
Units °C/W
Notes through are on page 8
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June 30, 2014
IRF6217PbF-1
Static @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Conditions
V(BR)DSS
Drain-to-Source Breakdown Voltage
ΔV(BR)DSS...
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