IGBT Module
VCE = IC =
1700 V 800 A
ABB HiPakTM
IGBT Module
5SNE 0800M170100
• Low-loss, rugged SPT chip-set • Smooth switching S...
Description
VCE = IC =
1700 V 800 A
ABB HiPakTM
IGBT Module
5SNE 0800M170100
Low-loss, rugged SPT chip-set Smooth switching SPT chip-set for
good EMC
Industry standard package High power density AlSiC base-plate for high power
cycling capability
AlN substrate for low thermal resistance
Doc. No. 5SYA1590-00 Oct 06
Maximum rated values 1)
Parameter
Symbol Conditions
min
Collector-emitter voltage
VCES VGE = 0 V, Tvj ≥ 25 °C
DC collector current
IC Tc = 80 °C
Peak collector current
ICM tp = 1 ms, Tc = 80 °C
Gate-emitter voltage
VGES
-20
Total power dissipation
Ptot Tc = 25 °C, per switch (IGBT)
DC forward current
IF
Peak forward current Surge current
IGBT short circuit SOA
IFRM
IFSM
VR = 0 V, Tvj = 125 °C, tp = 10 ms, half-sinewave
tpsc
VCC = 1200 V, VCEMCHIP ≤ 1700 V VGE ≤ 15 V, Tvj ≤ 125 °C
Isolation voltage
Visol 1 min, f = 50 Hz
Junction temperature
Tvj
Junction operating temperature Tvj(op)
-40
Case temperature
Tc
-40
Storage temperature
Tstg
-40
Mounting torques 2)
Ms Base-heatsink, M6 screws Mt1 Main terminals, M8 screws
4 8
Mt2 Auxiliary terminals, M4 screws
2
1) Maximum rated values indicate limits beyond which damage to the device may occur per IEC 60747 2) For detailed mounting instructions refer to ABB document no. 5SYA 2039 - 01
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.
max 1700 800 1600
20 4800 800 1600
6600
10
4000 150 125 125 125 6 10 3
Unit V A A V W A A
A
µs
V °C...
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