Patented Flip-Chip Series
8700 E. Thomas Road Scottsdale, AZ 85251 Tel: (480) 941-6300 Fax: (480) 947-1503
FLIP-CHIP TVS DIODES
CHFP6KE5.0
thru
...
Description
8700 E. Thomas Road Scottsdale, AZ 85251 Tel: (480) 941-6300 Fax: (480) 947-1503
FLIP-CHIP TVS DIODES
CHFP6KE5.0
thru
CHFP6KE170CA
FEATURES
Unidirectional and Bidirectional Fully glass passivated 600 watt (10/1000 µ s) Eliminates wire bonding NON Inductive Insertion No voltage overshoot
Patented Flip-Chip Series
MAXIMUM RATINGS
Max Junction Temperature: 1500C (with conformal coating) Storage Temperature: -550C to +1500C Flip-Chip Peak Pulse Power: 600 Watts (10/1000 µ s) Maximum non-repetitive peak power 600 Watts (10/1000 µ s) Total continuous power dissipation 2.5 W (with adequate heat sink @ 750C) Turn-on time (theoretical) unidirectional 1X10-12 Turn-on time (theoretical) bidirectional 1X10-9
MECHANICAL Weight: 0.01 grams (approximate)
Solderable standoff tabs .040X.040X.010 Waffle package 50 pices or wafer ring 70 pieces
PACKAGING
BIDIRECTIONAL ALL DIMENSIONS NOMINAL inches (mm) FLIP-CHIP DIMENSIONS PAD SIZE & CIRCUIT
UNIDIRECTIONAL ALL DIMENSIONS NOMINAL inches (mm) FLIP-CHIP DIMENSIONS PAD SIZE & CIRCUIT
VBR above 30 V
VBR 30V and below
MSC1596.PDF
ISO 9001 CERTIFIED
REV B 3/13/2000
CHFP6KE5.0 thru CHFP6KE170CA
PEAK PULSE POWER Vs PULSE TIME
Ppp – PEAK PULSE POWER – kW
PEAK PULSE POWER DERATING
TP – PULSE TIME – SEC TEMPERATURE °C
ATTACHMENT AND CONFORMAL COATING INSTRUCTIONS FOR Flip-Chip COMPONENTS
The .010” thick tab standoffs minimize shorting during attachment; however, minimal solder/conductive epoxy must be used...
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