Document
1.5SMC Series
TVS Diodes
Surface Mount – 1500W > 1.5SMC series
RoHS
Pb e3
Uni-directional
Bi-directional
Agency Approvals Agency
Agency File Number E230531
Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted)
Parameter
Symbol Value Unit
Peak Pulse Power Dissipation(Fig.2) by 10/1000us Test Waveform(Fig.4) (Note 1),(Note 2) -Single Die Parts)
PPPM
1500
W
Peak Pulse Power Dissipation(Fig.2) by 10/1000us Test Waveform(Fig.4) (Note 1), (Note 2)-Stacked Die Parts (Note 5)
PPPM
2000
W
Power Dissipation on Infinite Heat Sink at TL=50OC
PD
6.5
W
Peak Forward Surge Current, 8.3ms Single Half Sine Wave (Note 3)
IFSM
200
A
Maximum Instantaneous Forward Voltage at 100A for Unidirectional Only (Note 4)
VF
3.5/5.0 V
Operating Temperature Range
TJ -65 to 150 °C
Storage Temperature Range
TSTG -65 to 175 °C
Typical Thermal Resistance Junction to Lead
RƟJL
15 °C/W
Typical Thermal Resistance Junction to Ambient RƟJA
75 °C/W
Notes:
1. Non-repetitive current pulse , per Fig. 4 and derated above TJ (initial) =25OC per Fig. 3. 2. Mounted on copper pad area of 0.31x0.31” (8.0 x 8.0mm) to each terminal.
3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional device only, duty
cycle=4 per minute maximum.
4. VF < 3.5V for single die parts and VF< 5.0V for stacked-die parts. 5. For stacked die component details, please refer to part numbers labeled by * in Electrical Characteristics.
Functional Diagram
Cathode
Bi-directional Uni-directional
Anode
Descriptios
The 1.5SMC series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events.
Features
• 1500W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycles):0.01%
• Excellent clamping capability
• Low incremental surge resistance
• Typical IR less than 1μA when VBR min>12V
• For surface mounted applications to optimize board space
• Low profile package
• Built-in strain relief
• Typical failure mode is short from over-specified voltage or current
• Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
• IEC 61000-4-2 ESD 30kV(Air), 30kV (Contact)
• ESD protection of data lines in accordance with IEC 61000-4-2
• EFT protection of data lines in accordance with IEC 61000-4-4
• Fast response time: typically less than 1.0ps from 0V to BV min
• Glass passivated chip junction
• High temperature to reflow soldering guaranteed: 260°C/30sec
• VBR @ TJ= VBR@25°C x (1+αT x (TJ - 25)) (αT:Temperature Coefficient, typical value is 0.1%)
• Plastic package is flammability rated V-0 per Underwriters Laboratories
• Meet MSL level1, per J-STD-020, LF maximun peak of 260°C
• Matte tin lead–free plated
• Halogen free and RoHS
compliant
• Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD609A.01)
Applications
TVS devices are ideal for the pro.
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