Document
NSTS1444 Apr. 2013
NewJRC SAW FILTER
NSTS1444
Application
924MHz
Electrical Specification: (Table 1) The device characteristics are measured in the circuit shown in Fig.1.
Item Test Result
Spec.
Typ.
Input and Output Impedance
- 50Ω
Nominal Center Frequency (f0)
- 924MHz
Insertion Loss
3.0dB max.
2.3dB
Response Variation
920-928MHz
1.2dB max.
0.3dB
Input and Output VSWR
2.3 max.
1.5
Out of Band Rejection
DC-880MHz
40dB min.
50dB
(Relative to
880-900MHz
28dB min.
47dB
Through Level)
950-960MHz
23dB min.
32dB
960-1700MHz
40dB min.
50dB
1700-2100MHz
35dB min.
45dB
2400-2500MHz
25dB min.
38dB
Operating Temperature Range: -40~+85ºC
Maximum Rating: (Table 2)
Table 2. Maximum Ratings Item Maximum Input Power Maximum DC Voltage Operating Temperature Range Storage Temperature
Rating +20dBm 7.5V -40~+85ºC -40~+95ºC
Mechanical Specifications: (Fig.2) Package is designed as small as 3.0x3.0x1.15[mm3] for SMD (Surface Mount Device) type.
Notice: This part is electrostatic discharge sensitive and may be damaged by improper handling.
http://www.njr.co.jp/products/device/index.html http://www.njr.com/products/device/index.html
(Japanese) (English)
IN 50Ω 1 6
2 SAW 5
34
OUT 50Ω
NSTS1444 Apr. 2013
Fig.1 Measuring circuit
(a) 3. 0±0. 15 ( b)
3. 0 ± 0. 1 5
191
RA
( c) ( 1)
1. 1 5 ± 0. 1 5
( 2)
( 0. 6)
34
2
( 1. 80)
1
5 6
( 0. 45)
( 0. 75) [ 4x]
Fig.2 Package dimensions (in mm)
3.8
2.2 1.15
( 0. 2 5) ( 0. 6) [ 2 x]
( 0. 5 3) [ 4 x]
Marking (1) Lot Number
(a) Year (b) Month
*Oct.--Nov.--Dec.--(c) Date *1-9--10-19--20-31--(2) Part Number Mark
X Y Z
0 1 2
Pin no. 1 2 3 4 5 6
Connection GND IN GND GND OUT GND
1.15
3.8 0.93 0.6 0.93
Fig.3 Desirable land area (in mm)
NSTS1444 Apr. 2013
Notice
1. Use this component within operating temperature range. It might not be satisfied with electrical specification without operating temperature range. When it is used less than -30ºC or more than +85ºC, it might be a cause of degradation or destruction of the component. Even if it endures during a short time, it causes degradation of qualification.
2. When soldering iron is used, solder with the temperature at the tip of soldering iron: 350ºC max., the time of soldering: 5 seconds max., the power of soldering iron: 30W max..
3. Notice that the allowed time of soldering with soldering iron is accumulated time, when soldering is repeated.
4. As rapid temperature change for cleaning after reflow soldering might be a cause of destruction clean this component after confirming that temperature of this component goes down to room temperature.
5. Confirm that there are not any influence for qualification to this component in mounting on PCB when this component is cleaned.
6. As it might be a cause of degradation of destruction to apply static electricity to this component, do not apply static electricity or excessive voltage while assembling and measuring. And do not transport this component with bare hand.
7. As it mi.