THGBM4G5D1HBAIR

THGBM4G5D1HBAIR TOSHIBA e-MMC Module 4GB THGBM4G5D1HBAIR INTRODUCTION THGBM4G5D1HBAIR is 4-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit utilizes advanced TOSHIBA NAND flash devices and a controller chip assembled as Multi Chip Module. THGBM4G5D1HBAIR has an industry standard MMC protocol for easy use. FEATURES THGBM4G5D1HBAIR Interface THGBM4G5D1HBAIR has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support. Ball / Signal Allocation P-VFBGA153-1113-0.50-002 (11.5 x 13mm, H1.0mm max. package) 14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 12 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 11 NC NC NC NC NC NC 10 NC NC NC RFU RFU RFU Vss Vcc RFU NC NC RFU 9 NC NC NC RFU Vcc NC NC NC 8 NC NC NC 7 RFU NC NC RFU Vss Top View Vss RFU NC NC NC NC NC RFU 6 RFU DAT7 VccQ Vcc RFU CLK NC VssQ 5 DAT2 DAT6 RFU RFU Vcc Vss RFU RFU RST_n CMD VssQ VccQ 4 DAT1 DAT5 VssQ NC Index VccQ VccQ VssQ 3 DAT0 DAT4 NC NC NC NC RFU NC NC NC NC NC NC VccQ 2 NC DAT3 VDDi NC NC NC NC NC NC NC NC NC VssQ NC 1 NC NC NC NC NC NC NC NC NC NC NC NC NC NC ABCD E FGH J K LMN P Pin Number Name Pin Number Name Pin Number A3 DAT0 C2 VDDi J10 A4 DAT1 C4 VssQ K5 A5 DAT2 C6 VccQ K8 B2 DAT3 E6 Vcc K9 B3 DAT4 E7 Vss M4 B4 DAT5 F5 Vcc M5 B5 DAT6 G5 Vss M6 B6 DAT7 H10 Vss N2 NC: No Connect, can be connected to ground or left floating. RFU: Reserved for Future Use, should be...